LFE3-95E-6FN1156I

The LFE3-95E-6FN1156I is a LatticeECP3 family FPGA offering a high-density, DSP-capable fabric in a 1156‑ball BGA package. It combines 92,000 logic elements with approximately 4.53 Mbits of embedded RAM and 490 user I/Os to support high-speed, high-integration system designs.

Built for industrial applications, the device targets high-volume, high-speed, cost-conscious designs that require SERDES, enhanced DSP resources and flexible source-synchronous I/O, while operating over a wide industrial temperature range.

Key Features

• Core Capacity – 92,000 logic elements provide substantial logic resources for complex FPGA designs and system integration.
• Embedded Memory – Approximately 4.53 Mbits of on-chip RAM for buffering, packet processing and intermediate data storage.
• High I/O Count & Package – 490 user I/Os in a 1156‑BBGA (35 × 35 mm FPBGA) surface-mount package to support dense board-level connectivity.
• High-Speed SERDES – Family-level SERDES supports data rates from 150 Mbps to 3.2 Gbps and, in the 1156 package, up to 12 SERDES channels for serial links and multi‑lane protocols.
• Enhanced DSP Resources – sysDSP architecture with cascadable slices, support for wide ALU operations and hardware multipliers to accelerate MAC and signal-processing tasks.
• Multiplier & PLL/DLL Resources – Device-level resources include 128 18×18 multipliers and support for up to ten PLLs and two DLLs for clocking and timing control.
• Flexible sysI/O – Programmable I/O supports a wide range of standards and source-synchronous interfaces, with on-chip termination and dedicated DDR/DDR2/DDR3 DQS support noted at the family level.
• Industrial Grade & Power – Industrial operating range of -40 °C to 100 °C and a supply/operating voltage window of 1.14 V to 1.26 V.
• Surface Mount Package – 1156‑BBGA, surface-mount form factor suitable for production assembly.
• Standards & Tools Support – Family-level support includes IEEE 1149.1/1532 and on-chip utilities for configuration and debug as documented in the ECP3 family data.

Typical Applications

• High-speed communications – Implement serial protocols and multi‑lane links using the embedded SERDES and high I/O count for interfaces such as Ethernet, PCIe and other serial standards referenced at the family level.
• Signal processing and video – Leverage sysDSP slices and extensive multiplier resources for filtering, transforms and real-time processing pipelines.
• Memory and storage controllers – Use source-synchronous I/O and DDR/DDR2/DDR3 DQS support at the family level to implement memory interfaces and buffering logic.
• Industrial control and measurement – Industrial temperature rating and high integration make the device suitable for motor control, sensor aggregation and automation systems requiring robust I/O.

Unique Advantages

• Highly integrated resource set: 92,000 logic elements with ~4.53 Mbits embedded RAM and 128 hardware multipliers reduce external components and simplify system design.
• High port density: 490 I/Os in a 1156‑ball package provide flexible board routing options and support complex mixed-signal and multi-protocol designs.
• High-speed serial connectivity: Family SERDES capability to 3.2 Gbps and up to 12 channels in the 1156 package enables efficient implementation of serial links and backplane interfaces.
• Industrial robustness: Rated for -40 °C to 100 °C operation and surface-mount packaging suitable for industrial assembly and deployment.
• Clocking and DSP flexibility: Up to ten PLLs and two DLLs plus sysDSP slices support advanced timing architectures and compute-intensive signal processing tasks.

Why Choose LFE3-95E-6FN1156I?

The LFE3-95E-6FN1156I balances high logic capacity, substantial embedded memory and rich I/O in a production-ready BGA package for industrial applications. Its combination of DSP-oriented resources, high-speed serial capability and programmable I/O makes it a practical choice for designers building high-throughput communications, processing or control systems that require a compact, integrated FPGA solution.

Backed by the LatticeECP3 family feature set, the device delivers the building blocks for scalable designs with on-chip memory, clocking and serial interfaces to shorten development time and reduce board-level complexity.

Request a quote or submit an RFQ to obtain pricing, lead-time and availability information for the LFE3-95E-6FN1156I.