LFE3-95E-6FN672C

IC FPGA 380 I/O 672FPBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 380 4526080 92000 672-BBGA

Quantity 931 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O380Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11500Number of Logic Elements/Cells92000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-95E-6FN672C – ECP3 Field Programmable Gate Array (FPGA) IC, 672-BBGA

The LFE3-95E-6FN672C is a Lattice Semiconductor ECP3 family FPGA offering a high-density, feature-rich reconfigurable fabric suitable for high-performance embedded and communications designs. It combines 92,000 logic elements with flexible on-chip memory and high-speed I/O capability in a 672-ball BGA package.

Designed for commercial applications, this device operates from a 1.14 V to 1.26 V core supply and within a 0 °C to 85 °C temperature range. The ECP3 family foundation provides enhanced DSP resources, embedded SERDES and system-level configuration support to address high-speed, low-cost system integration.

Key Features

  • Logic Capacity — 92,000 logic elements to implement complex control, signal-processing and glue-logic functions with scalable LUT-based fabric.
  • On-chip Memory — Approximately 4.53 Mbits of embedded memory (4,526,080 total RAM bits) for buffers, FIFOs and state storage.
  • High-density I/O & Package — 380 user I/Os in a 672-ball FBGA package (672-FPBGA, 27 × 27 mm) for broad interface routing and board-level integration.
  • High-performance DSP Resources — ECP3 family DSP architecture includes dedicated multiply resources (ECP3-95 supports 18×18 multipliers) for efficient MAC and DSP implementations.
  • Embedded SERDES & High-Speed Interfaces — Family-level SERDES support with data rates from 150 Mbps up to 3.2 Gbps and protocol support for PCI Express, Ethernet variants, SONET/SDH, CPRI, SMPTE 3G and Serial RapidIO.
  • Flexible Configuration & System Tools — Supports SPI boot flash, dual-boot images, TransFR I/O for field updates, Soft Error Detect macro, on-chip oscillator, and family tools such as Reveal Logic Analyzer and ORCAstra configuration utility.
  • Power & Environmental — Core voltage supply range 1.14 V to 1.26 V and commercial operating temperature 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Networking & Communications — Implementation of packet processing, SERDES-based links and protocol bridging using the device’s high-speed serial capabilities and abundant I/O.
  • Video & Broadcast Interfaces — Support for SMPTE 3G and high-speed ADC/DAC interfaces for video ingest, routing and processing.
  • Embedded Signal Processing — DSP-accelerated tasks such as filtering, FFTs and MAC-heavy algorithms leveraging the device’s multiply resources and on-chip memory.
  • Memory Controllers & Interface Bridging — Dedicated source-synchronous support and memory interface features suitable for DDR family memory control and high-throughput buffering.

Unique Advantages

  • High Logic Density: 92,000 logic elements enable consolidation of multiple system functions into a single device, reducing PCB complexity.
  • Substantial Embedded Memory: Approximately 4.53 Mbits of on-chip RAM for large buffers and data-path staging without requiring external RAM for many designs.
  • Rich I/O & Package Options: 380 I/Os in a 27 × 27 mm 672-FPBGA package provide broad signal routing flexibility for mixed-protocol systems.
  • Built-in High-speed SerDes & Protocol Support: Family-level SERDES performance up to 3.2 Gbps enables modern serial links used in networking and broadcast applications.
  • System-level Configuration & Reliability: SPI boot, dual-boot, Soft Error Detect and field-update features simplify deployment and in-field maintenance.
  • Commercial-grade Operating Range: 0 °C to 85 °C and RoHS compliance for mainstream electronic products.

Why Choose LFE3-95E-6FN672C?

The LFE3-95E-6FN672C positions itself as a high-density, versatile FPGA option within the LatticeECP3 family, combining a large logic fabric, significant embedded memory and extensive I/O in a compact 672-BBGA package. Its family-level DSP, SERDES and system configuration features make it suitable for designs that require integrated signal processing, high-speed serial links and flexible boot/configuration options.

This device is well suited for engineering teams developing high-volume, high-speed commercial applications who value a balanced combination of performance, integration and available development utilities from the Lattice ECP3 ecosystem.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE3-95E-6FN672C.

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