LFE3-95E-7FN1156C

The LFE3-95E-7FN1156C is a Lattice ECP3 field-programmable gate array (FPGA) supplied in a 1156-ball BGA (35 × 35 mm) package for surface-mount assembly. This commercial-grade device combines a dense logic fabric with multi-megabit embedded memory and a large I/O count to support processing, interface bridging and high-integration system designs.

Designed for applications that require substantial on-chip logic and I/O bandwidth, the device offers 92,000 logic elements, approximately 4.526 Mbits of embedded RAM, 11,500 CLBs and 490 user I/Os while operating from a 1.14 V to 1.26 V core supply at 0 °C to 85 °C.

Key Features

• Logic Capacity  92,000 logic elements and 11,500 CLBs provide ample programmable fabric for complex control, signal processing and glue-logic integration.
• Embedded Memory  Approximately 4.526 Mbits of on-chip RAM supports large buffers, FIFOs and memory-intensive algorithms without external memory.
• I/O Density  490 user I/Os in the 1156-BBGA package enable wide parallel interfaces and multiple simultaneous high-pin-count connections.
• Package & Mounting  1156-FPBGA (35×35) package in a 1156-BBGA footprint, designed for surface-mount PCB assembly and high-density board designs.
• Power Supply & Temperature  Core voltage range of 1.14 V to 1.26 V and commercial operating range of 0 °C to 85 °C to match typical embedded system environments.
• High-speed I/O and SERDES (family capability)  Family-level support for embedded SERDES and high-speed source-synchronous interfaces enables integration of high-bandwidth serial links and protocol interfaces.
• sysDSP and DSP Resources (family capability)  Enhanced sysDSP slice architecture for multiply-accumulate and ALU operations, enabling efficient implementation of signal-processing tasks.
• Clocking and Timing  On-chip PLLs and DLLs (family-level support) for flexible clock management and timing control across logic and I/O domains.
• Configurable I/O Standards (family capability)  Programmable I/O buffer options covering a wide range of single-ended and differential standards to interface with diverse peripherals.
• RoHS Compliant  Device is RoHS-compliant for regulatory and environmental requirements.

Typical Applications

• Network & Interface Bridging  Use the device’s high I/O count and family SERDES capabilities to implement protocol bridging, packet buffering and custom interface logic.
• High-density Embedded Control  Large logic capacity and embedded RAM make this FPGA suitable for complex control systems, motor-drive controllers and multi-domain management subsystems.
• Signal Processing Acceleration  sysDSP resources and substantial on-chip RAM enable implementation of filtering, DSP acceleration and aggregation tasks within a single device.
• Multi-channel I/O Aggregation  490 I/Os in a compact BGA package allow consolidation of sensor, user-interface and peripheral connections onto a single programmable device.

Unique Advantages

• High integration density:  92,000 logic elements and ~4.526 Mbits of embedded RAM reduce the need for external components and simplify system BOMs.
• Broad I/O capability:  490 user I/Os in the 1156-BBGA package provide flexibility to implement multiple parallel and serial interfaces without board-level multiplexing.
• Commercial temperature suitability:  Rated for 0 °C to 85 °C for reliable operation in standard embedded and industrial-adjacent applications.
• Configurable performance:  On-chip clocking and DSP slice architectures (family features) enable designers to tune performance for compute- and timing-sensitive tasks.
• RoHS-compliant supply:  Meets environmental compliance requirements to support modern manufacturing and distribution needs.

Why Choose LFE3-95E-7FN1156C?

This Lattice ECP3 device strikes a balance between large on-chip resources and high I/O capacity, making it well suited for designs that demand substantial logic, memory and interface integration within a single surface-mount BGA package. Its commercial-grade operating range and RoHS compliance make it appropriate for a wide range of mainstream embedded and communications applications.

Choose LFE3-95E-7FN1156C when you need a scalable, high-density programmable fabric with extensive I/O, embedded memory and family-level capabilities for DSP and high-speed interfaces—helping reduce external components and streamline system architecture.

If you would like pricing, availability or a formal quote for LFE3-95E-7FN1156C, submit a request for a quote or a pricing inquiry and our team will respond with details tailored to your procurement and volume needs.