LFE3-95E-7FN672C

The LFE3-95E-7FN672C is a member of the LatticeECP3 family of SRAM-based FPGAs from Lattice Semiconductor Corporation. It delivers a balance of high logic density, abundant I/O and on-chip memory in a compact 672-BBGA package, suitable for system integration where high-speed interfaces and DSP functions are required.

This device targets applications that require flexible, reconfigurable logic and embedded resources — for example, communications interfaces, signal processing and high-speed serial connectivity — leveraging family-level features such as embedded SERDES, sysDSP slices and extensive clock-management resources.

Key Features

• Core Logic — 92,000 logic elements to implement complex digital logic and system consolidation.
• Embedded Memory — Total on-chip RAM of 4,526,080 bits (approximately 4.53 Mbits) for FIFOs, buffering and local data storage.
• I/O and Package — 380 user I/Os in a 672-BBGA package (supplier package 672-FPBGA, 27x27), supporting high-pin-count board designs.
• High-speed SERDES — Family-level embedded SERDES supporting multi-gigabit data rates up to 3.2 Gbps per channel and common serial protocols indicated for the ECP3 family.
• sysDSP and Multipliers — Enhanced DSP slice architecture with dedicated 18×18 multipliers (128 for the ECP3-95 configuration) to accelerate multiply-accumulate and other signal-processing tasks.
• Clock Management — Device-level clocking with up to ten PLLs and two DLLs (ECP3-95 configuration) for flexible timing and clock-domain control.
• Power — Core voltage supply range 1.14 V to 1.26 V for low-voltage operation.
• Operating Range and Compliance — Commercial-grade operating temperature 0 °C to 85 °C and RoHS compliant.
• System-Level Support — Family datasheet lists configuration and debug capabilities including IEEE 1149.1 and IEEE 1532 compliance, logic analysis and configuration utilities.

Typical Applications

• High-speed Communications — Implement multi-protocol serial links and interfaces (examples in the ECP3 family include PCI Express, Ethernet and SONET/SDH) using the device’s embedded SERDES and abundant I/O.
• Video and Broadcast — Support SMPTE 3G and related video transport functions with high-speed serial connectivity and on-chip buffering.
• Signal Processing and Data Acquisition — Use sysDSP slices and dedicated multipliers for filtering, DSP pipelines and interfacing to high-speed ADC/DAC devices.
• Embedded System Integration — Consolidate glue logic, peripheral interfaces and timing-critical functions into a single FPGA with plentiful logic elements, memory and clock-management resources.

Unique Advantages

• High Logic Density: 92,000 logic elements enable integration of large functions and multiple subsystems on a single device, reducing board-level complexity.
• Substantial On-chip Memory: Approximately 4.53 Mbits of embedded RAM supports FIFOs, packet buffering and local data storage without external memory in many designs.
• Extensive I/O Count: 380 user I/Os provide flexibility for high-pin-count interfaces and mixed-signal front-ends.
• Multi-Gigabit Connectivity: Embedded SERDES with family-level support for protocols and data rates up to 3.2 Gbps per channel enable high-throughput links.
• Dedicated DSP Resources: sysDSP slices and 18×18 multipliers accelerate compute-heavy signal processing while keeping critical paths on-chip.
• Flexible Clocking: Up to ten PLLs and two DLLs enable robust clock management across multiple domains and high-speed I/O.

Why Choose LFE3-95E-7FN672C?

The LFE3-95E-7FN672C combines a high count of logic elements, substantial embedded memory and a large I/O complement in a 672-BBGA package, delivering a practical balance of performance and integration for communications, video and signal-processing designs. As a member of the LatticeECP3 family, it brings family-level features such as embedded SERDES, enhanced sysDSP slices and extensive clock management to system designs that require reconfigurable logic with high-speed interfaces.

This device is well suited to designers looking to consolidate functions, accelerate DSP workloads on-chip and implement complex I/O schemes while maintaining commercial-temperature operation and RoHS compliance.

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