LFE3-95E-8FN1156I

The LFE3-95E-8FN1156I is a Lattice ECP3 family field-programmable gate array (FPGA) in a 1156-ball BGA package. It combines a high-density logic fabric with large on-chip memory and extensive I/O to address industrial and high-performance embedded applications.

Key hardware specifications include approximately 92,000 logic elements, approximately 4.53 Mbits of embedded memory, 490 user I/Os, and an industrial operating range of −40 °C to 100 °C. The device is RoHS compliant and intended for surface-mount assembly.

Key Features

• Core Logic Approximately 92,000 logic elements based on the LatticeECP3 architecture for complex logic integration and control.
• Embedded Memory Approximately 4.53 Mbits of on-chip RAM (Total Ram Bits: 4,526,080) to support frame buffering, packet queues, and intermediate data storage without external memory.
• I/O and Package 490 user I/Os in a 1156-ball BBGA (35 × 35 mm) surface-mount package (supplier package: 1156-FPBGA) for high-pin-count system designs.
• High-Speed Serial and DSP Capabilities (Family-Level) Built on the LatticeECP3 family architecture, which includes embedded SERDES and an enhanced sysDSP architecture suitable for high-speed serial links and DSP workloads (features described in the ECP3 family datasheet).
• Power Core voltage supply specified from 1.14 V to 1.26 V, aligning with the family’s 1.2 V core supply requirements.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C and specified as Industrial grade for designs requiring extended temperature performance.
• Standards and Configuration Support (Family-Level) Family datasheet documents flexible configuration options including SPI boot flash interface, dual-boot images, and system-level utilities and analyzers.
• Compliance RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• High-speed communications — Implement serial interfaces and protocol bridging where multiple SERDES channels and plentiful I/O are required (ECP3 family supports a range of SERDES modes as described in the datasheet).
• Embedded DSP and signal processing — Use the device’s logic density and on-chip memory for acceleration of DSP tasks and real-time data processing in embedded systems.
• Industrial networking and control — Leverage industrial temperature rating and extensive I/O for ruggedized control, monitoring, and industrial protocol implementations.
• Video and broadcast processing — Employ the device’s memory and DSP-oriented architecture for buffering, formatting, and streaming tasks in video pipelines (family-level features support high-speed source-synchronous interfaces).

Unique Advantages

• High integration density: Approximately 92,000 logic elements and multi‑Mbit embedded memory reduce the need for external glue logic and memory, simplifying BOM and board area.
• Large I/O count in a compact package: 490 user I/Os in a 1156‑ball BGA provide extensive external connectivity while maintaining a 35×35 mm package footprint.
• Industrial temperature capability: −40 °C to 100 °C rating supports deployment in demanding thermal environments without additional thermal derating.
• Configurable power envelope: 1.14–1.26 V core supply range supports standard 1.2 V system power architectures.
• Designed for system-level features: Family-level configuration and instrumentation features (dual-boot, SPI flash boot, on-chip oscillator, and logic analysis utilities) streamline development and field updates.

Why Choose LFE3-95E-8FN1156I?

The LFE3-95E-8FN1156I targets designers who need a balance of high logic density, substantial on-chip memory, and a large I/O count in an industrial-grade package. Its LatticeECP3 family architecture brings DSP-oriented resources and high-speed serial capabilities to integrated system designs while supporting flexible configuration and development utilities documented in the family datasheet.

This device is well suited for engineers building communication endpoints, industrial controllers, and embedded processing modules that require on-chip memory, many I/Os, and operation across an extended temperature range. The combination of device-level specifications and family-level capabilities provides a scalable platform for mid- to high-density FPGA implementations.

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