LFE3-95E-8FN1156C

The LFE3-95E-8FN1156C is a Lattice Semiconductor ECP3-series FPGA supplied in a 1156-ball BGA package (35 × 35 mm). It provides a mid-to-high logic density fabric with 92,000 logic elements, approximately 4.53 Mbits of embedded memory, and 490 user I/Os—designed for applications that require abundant I/O, on-chip memory and DSP resources in a commercial-grade device.

Built around the LatticeECP3 architecture, the device integrates scalable DSP resources, high-performance SERDES and a flexible I/O subsystem to support communications, data acquisition and high‑throughput embedded designs while operating from a 1.14 V to 1.26 V core supply.

Key Features

• Logic Capacity — 92,000 logic elements to implement complex digital logic and custom processing pipelines.
• Embedded Memory — Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) for buffering, FIFOs and local data storage.
• DSP Resources — Family sysDSP architecture and dedicated multipliers; ECP3-95 device-level resources include 128 18×18 multipliers for high-performance multiply-accumulate operations.
• High-speed SERDES — Embedded SERDES supporting data rates up to 3.2 Gbps and commonly used serial protocols for multi‑Gbps links and board-level high-speed interfaces.
• Flexible sysI/O — Programmable I/O supporting a wide range of standards including LVTTL/LVCMOS, SSTL, HSTL and LVDS; I/O count: 490 user I/Os on the 1156‑ball package.
• Clocking — Multiple analog PLLs and DLLs (device family supports up to ten PLLs and two DLLs) for flexible clock generation and management.
• Configuration and System Support — SPI boot flash interface, dual‑boot image capability, TransFR I/O for field updates and on‑chip oscillator for initialization; includes support utilities referenced in the family datasheet.
• Package and Thermal — 1156‑ball FPBGA (35 × 35 mm) package; commercial operating temperature range of 0 °C to 85 °C.
• Power — Core supply operating range: 1.14 V to 1.26 V, enabling low-voltage core operation aligned with the ECP3 family architecture.
• Compliance — RoHS compliant.

Typical Applications

• Telecommunications & Networking — Implement protocol bridging, packet processing or PHY interfacing using embedded SERDES and abundant I/O.
• High‑Speed Data Acquisition — Local buffering and DSP preprocessing for ADC/DAC front ends using on‑chip RAM and 18×18 multipliers.
• Broadcast & Video — Processing and transport of high‑bandwidth video streams leveraging SERDES links and source‑synchronous I/O capabilities.
• Embedded Systems & Industrial Electronics — Control, protocol conversion and custom logic for systems that require substantial I/O and on‑chip resources within a commercial temperature range.

Unique Advantages

• High logic density and memory in a single device: 92,000 logic elements paired with approximately 4.53 Mbits of embedded RAM reduce external memory needs and enable more compact designs.
• Integrated high‑speed serial capability: On‑chip SERDES (up to 3.2 Gbps) simplifies board routing for multi‑Gbps links and reduces the need for external PHYs for many use cases.
• Rich DSP resources: Dedicated 18×18 multipliers and sysDSP architecture accelerate MAC‑intensive tasks such as filtering, transforms and signal processing blocks.
• Comprehensive I/O flexibility: 490 user I/Os with support for common single‑ended and differential standards enable broad peripheral and system interfacing without gate‑count compromises.
• Robust system support and configuration options: SPI boot, dual‑boot images and field update mechanisms facilitate secure and flexible deployment and updates.
• Commercial temperature and RoHS compliance: Ready for mainstream embedded and communications products with 0 °C to 85 °C operating range and environmental compliance.

Why Choose LFE3-95E-8FN1156C?

The LFE3-95E-8FN1156C combines substantial logic density, on‑chip memory and DSP resources with high-speed serial interfaces and a broad, programmable I/O set in a 1156‑ball BGA package. It is well suited to designers who require integrated SERDES, plentiful I/O and significant local RAM to build compact, high-throughput systems within a commercial temperature envelope.

As a member of the LatticeECP3 family, the device benefits from the family’s configuration and system utilities and is positioned for applications where performance, I/O flexibility and integrated DSP/memory reduce board-level complexity and BOM count.

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