LFE3-95E-7FN484I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA |
|---|---|
| Quantity | 623 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11500 | Number of Logic Elements/Cells | 92000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-95E-7FN484I – ECP3 FPGA, 92,000 logic elements, 484-BBGA
The LFE3-95E-7FN484I is a Lattice Semiconductor ECP3 family field programmable gate array (FPGA) featuring 92,000 logic elements in a 484-ball BGA package. Built around the ECP3 architecture, this device combines high logic density, on-chip memory, embedded DSP resources and flexible I/O to address high-performance embedded and communications applications.
With 295 user I/Os, embedded SERDES capability described by the ECP3 family, and approximately 4.53 Mbits of on-chip RAM, this industrial-grade device is suited for designs that require substantial logic, on-chip memory and multi-protocol serial connectivity in a compact surface-mount package.
Key Features
- Core Logic 92,000 logic elements provide a high-density programmable fabric for complex control, protocol and signal-processing logic.
- Embedded Memory Total on-chip RAM of approximately 4.53 Mbits to support large buffering, state storage and embedded data structures.
- DSP and Arithmetic Architecture includes the ECP3 family’s enhanced sysDSP capabilities (family-level features) for multiply–accumulate and high-performance arithmetic.
- High-Speed Serial and I/O Part of the ECP3 family that supports embedded SERDES and a wide range of programmable I/O standards, enabling multi-protocol serial interfaces and source-synchronous links.
- Clocking and Timing Family-level support for multiple PLLs and DLLs provides flexible clock generation and deskewing options for system timing.
- Package and Mounting 484-ball BGA (supplier device package: 484-FPBGA, 23×23 mm) designed for surface-mount assembly.
- Power and Temperature Core supply voltage range of 1.14 V to 1.26 V and industrial operating temperature range of -40 °C to 100 °C for robust field operation.
- Industrial Grade and Compliance Specified as Industrial grade and RoHS compliant.
Typical Applications
- High-speed serial communications Implement PCI Express, Ethernet and other multi-gigabit protocols using the ECP3 family’s SERDES and programmable I/O features.
- Signal processing and converters Use sysDSP resources and on-chip RAM for ADC/DAC interfacing, digital filtering and real-time signal conditioning.
- Memory interface and buffering Support DDR/DDR2/DDR3-type source-synchronous memory interfaces and large on-chip buffers for data staging and throughput smoothing.
- Embedded control and protocol bridging Combine high logic density and flexible I/O to implement protocol conversion, real-time control logic and complex state machines.
Unique Advantages
- High integration density: 92,000 logic elements and approximately 4.53 Mbits of embedded memory reduce external component count and simplify PCB design.
- Broad I/O and serial support: 295 user I/Os and ECP3 family SERDES and I/O standards support enable a wide range of interface options without external PHYs.
- Industrial operating range: Rated from -40 °C to 100 °C to meet demanding environmental requirements.
- Compact, manufacturable package: 484-ball FPBGA (23×23 mm) surface-mount package provides high pin density in a board-friendly form factor.
- Precision power domain: Narrow core voltage range (1.14 V to 1.26 V) supports stable core operation and predictable power budgeting.
- System-level support (family features): ECP3 family tooling and utilities provide configuration, debug and integration aids referenced for this device class.
Why Choose LFE3-95E-7FN484I?
The LFE3-95E-7FN484I positions itself where high logic capacity, significant on-chip memory and comprehensive I/O converge in an industrial-grade FPGA. Its 92,000 logic elements, roughly 4.53 Mbits of embedded RAM and 295 I/Os make it an effective choice for mid-to-high complexity embedded systems requiring DSP functions, high-speed serial links and flexible memory interfacing.
This device is suited for engineering teams building communication endpoints, data acquisition systems, protocol bridges and other applications that benefit from the ECP3 family’s balance of integration, programmable I/O and system-level features.
Request a quote or submit a product inquiry to evaluate the LFE3-95E-7FN484I for your next design project.

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