LFE3-95E-7FN484I

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA

Quantity 623 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11500Number of Logic Elements/Cells92000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-95E-7FN484I – ECP3 FPGA, 92,000 logic elements, 484-BBGA

The LFE3-95E-7FN484I is a Lattice Semiconductor ECP3 family field programmable gate array (FPGA) featuring 92,000 logic elements in a 484-ball BGA package. Built around the ECP3 architecture, this device combines high logic density, on-chip memory, embedded DSP resources and flexible I/O to address high-performance embedded and communications applications.

With 295 user I/Os, embedded SERDES capability described by the ECP3 family, and approximately 4.53 Mbits of on-chip RAM, this industrial-grade device is suited for designs that require substantial logic, on-chip memory and multi-protocol serial connectivity in a compact surface-mount package.

Key Features

  • Core Logic  92,000 logic elements provide a high-density programmable fabric for complex control, protocol and signal-processing logic.
  • Embedded Memory  Total on-chip RAM of approximately 4.53 Mbits to support large buffering, state storage and embedded data structures.
  • DSP and Arithmetic  Architecture includes the ECP3 family’s enhanced sysDSP capabilities (family-level features) for multiply–accumulate and high-performance arithmetic.
  • High-Speed Serial and I/O  Part of the ECP3 family that supports embedded SERDES and a wide range of programmable I/O standards, enabling multi-protocol serial interfaces and source-synchronous links.
  • Clocking and Timing  Family-level support for multiple PLLs and DLLs provides flexible clock generation and deskewing options for system timing.
  • Package and Mounting  484-ball BGA (supplier device package: 484-FPBGA, 23×23 mm) designed for surface-mount assembly.
  • Power and Temperature  Core supply voltage range of 1.14 V to 1.26 V and industrial operating temperature range of -40 °C to 100 °C for robust field operation.
  • Industrial Grade and Compliance  Specified as Industrial grade and RoHS compliant.

Typical Applications

  • High-speed serial communications  Implement PCI Express, Ethernet and other multi-gigabit protocols using the ECP3 family’s SERDES and programmable I/O features.
  • Signal processing and converters  Use sysDSP resources and on-chip RAM for ADC/DAC interfacing, digital filtering and real-time signal conditioning.
  • Memory interface and buffering  Support DDR/DDR2/DDR3-type source-synchronous memory interfaces and large on-chip buffers for data staging and throughput smoothing.
  • Embedded control and protocol bridging  Combine high logic density and flexible I/O to implement protocol conversion, real-time control logic and complex state machines.

Unique Advantages

  • High integration density: 92,000 logic elements and approximately 4.53 Mbits of embedded memory reduce external component count and simplify PCB design.
  • Broad I/O and serial support: 295 user I/Os and ECP3 family SERDES and I/O standards support enable a wide range of interface options without external PHYs.
  • Industrial operating range: Rated from -40 °C to 100 °C to meet demanding environmental requirements.
  • Compact, manufacturable package: 484-ball FPBGA (23×23 mm) surface-mount package provides high pin density in a board-friendly form factor.
  • Precision power domain: Narrow core voltage range (1.14 V to 1.26 V) supports stable core operation and predictable power budgeting.
  • System-level support (family features): ECP3 family tooling and utilities provide configuration, debug and integration aids referenced for this device class.

Why Choose LFE3-95E-7FN484I?

The LFE3-95E-7FN484I positions itself where high logic capacity, significant on-chip memory and comprehensive I/O converge in an industrial-grade FPGA. Its 92,000 logic elements, roughly 4.53 Mbits of embedded RAM and 295 I/Os make it an effective choice for mid-to-high complexity embedded systems requiring DSP functions, high-speed serial links and flexible memory interfacing.

This device is suited for engineering teams building communication endpoints, data acquisition systems, protocol bridges and other applications that benefit from the ECP3 family’s balance of integration, programmable I/O and system-level features.

Request a quote or submit a product inquiry to evaluate the LFE3-95E-7FN484I for your next design project.

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