LFE3-95E-7FN484C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA |
|---|---|
| Quantity | 555 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11500 | Number of Logic Elements/Cells | 92000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-95E-7FN484C – ECP3 Field Programmable Gate Array (FPGA), 92,000 logic elements, 484-BBGA
The LFE3-95E-7FN484C is a commercial-grade ECP3 family FPGA from Lattice Semiconductor Corporation designed for high-density logic integration and flexible I/O. This device provides 92,000 logic elements and approximately 4.53 Mbits of embedded memory in a 484-ball fine-pitch BGA package, making it suitable for high-channel-count applications that require significant on-chip logic and RAM.
Built on the ECP3 architecture, the device targets applications that need a mix of DSP capability, high-speed serial connectivity, and abundant I/O while operating from a 1.14 V to 1.26 V core supply across a 0 °C to 85 °C commercial temperature range.
Key Features
- Core Logic Provides 92,000 logic elements to implement complex control, processing, and glue-logic functions on a single device.
- Embedded Memory Approximately 4.53 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing without external memory.
- DSP and Arithmetic Resources ECP3 family sysDSP architecture supports high-performance multiply and accumulate operations and multiple 18×18 multipliers (family-level capability referenced in the datasheet).
- High-speed Serial and Protocol Support Family-level embedded SERDES support with data rates up to 3.2 Gbps for serial interfaces and protocol implementations.
- Flexible I/O 295 user I/Os in the 484-BBGA package to support wide parallel interfaces, multiple peripherals, and board-level routing density.
- Package and Mounting 484-FPBGA (23 × 23 mm) surface-mount package for compact, board-level deployment.
- Power and Thermal Core supply range 1.14 V to 1.26 V; commercial operating temperature range from 0 °C to 85 °C.
- Compliance RoHS compliant and intended for commercial-grade applications.
Typical Applications
- High-speed Communications Implement protocol bridging, SERDES-based links, and custom packet processing using the device's high-speed serial capabilities and abundant I/O.
- Signal Processing & Video On-chip RAM and DSP slices enable buffering, filtering, and real-time processing tasks for imaging, video transport, and streaming pipelines.
- Industrial and Instrumentation Systems Use the FPGA for multi-channel sensor aggregation, control logic, and custom I/O interfacing in commercial automation and test equipment.
- Prototyping and OEM Integration High logic density and broad I/O make the device suitable for system integration, IP consolidation, and prototype-to-production designs.
Unique Advantages
- High Logic Capacity: 92,000 logic elements let you consolidate functions that would otherwise require multiple devices, reducing BOM and board complexity.
- Significant On-chip Memory: Approximately 4.53 Mbits of embedded RAM supports large buffers and state machines without external memory overhead.
- Rich I/O Count: 295 I/Os in a 484-BBGA footprint enable dense peripheral and bus connections for complex system interfaces.
- Family-level High-speed Serial Support: ECP3 family SERDES capabilities support a wide range of serial protocols and data rates up to 3.2 Gbps for scalable link implementations.
- Commercial-Grade Operation: Designed for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial product deployments.
Why Choose LFE3-95E-7FN484C?
The LFE3-95E-7FN484C delivers a balanced combination of high logic density, substantial embedded memory, and a large I/O count in a compact 484-ball BGA package. It is positioned for designers who need to integrate DSP functions, sizable on-chip buffering, and flexible high-speed I/O in commercial systems.
As part of the Lattice ECP3 family, this device is suitable for customers looking for scalable FPGA resources with family-level features such as advanced DSP slices and SERDES support, enabling streamlined design reuse and reliable product evolution.
Request a quote or submit a purchase inquiry for the LFE3-95E-7FN484C to get pricing and availability information.

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