LFE3-95E-7FN484C

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA

Quantity 555 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11500Number of Logic Elements/Cells92000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-95E-7FN484C – ECP3 Field Programmable Gate Array (FPGA), 92,000 logic elements, 484-BBGA

The LFE3-95E-7FN484C is a commercial-grade ECP3 family FPGA from Lattice Semiconductor Corporation designed for high-density logic integration and flexible I/O. This device provides 92,000 logic elements and approximately 4.53 Mbits of embedded memory in a 484-ball fine-pitch BGA package, making it suitable for high-channel-count applications that require significant on-chip logic and RAM.

Built on the ECP3 architecture, the device targets applications that need a mix of DSP capability, high-speed serial connectivity, and abundant I/O while operating from a 1.14 V to 1.26 V core supply across a 0 °C to 85 °C commercial temperature range.

Key Features

  • Core Logic  Provides 92,000 logic elements to implement complex control, processing, and glue-logic functions on a single device.
  • Embedded Memory  Approximately 4.53 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing without external memory.
  • DSP and Arithmetic Resources  ECP3 family sysDSP architecture supports high-performance multiply and accumulate operations and multiple 18×18 multipliers (family-level capability referenced in the datasheet).
  • High-speed Serial and Protocol Support  Family-level embedded SERDES support with data rates up to 3.2 Gbps for serial interfaces and protocol implementations.
  • Flexible I/O  295 user I/Os in the 484-BBGA package to support wide parallel interfaces, multiple peripherals, and board-level routing density.
  • Package and Mounting  484-FPBGA (23 × 23 mm) surface-mount package for compact, board-level deployment.
  • Power and Thermal  Core supply range 1.14 V to 1.26 V; commercial operating temperature range from 0 °C to 85 °C.
  • Compliance  RoHS compliant and intended for commercial-grade applications.

Typical Applications

  • High-speed Communications  Implement protocol bridging, SERDES-based links, and custom packet processing using the device's high-speed serial capabilities and abundant I/O.
  • Signal Processing & Video  On-chip RAM and DSP slices enable buffering, filtering, and real-time processing tasks for imaging, video transport, and streaming pipelines.
  • Industrial and Instrumentation Systems  Use the FPGA for multi-channel sensor aggregation, control logic, and custom I/O interfacing in commercial automation and test equipment.
  • Prototyping and OEM Integration  High logic density and broad I/O make the device suitable for system integration, IP consolidation, and prototype-to-production designs.

Unique Advantages

  • High Logic Capacity:  92,000 logic elements let you consolidate functions that would otherwise require multiple devices, reducing BOM and board complexity.
  • Significant On-chip Memory:  Approximately 4.53 Mbits of embedded RAM supports large buffers and state machines without external memory overhead.
  • Rich I/O Count:  295 I/Os in a 484-BBGA footprint enable dense peripheral and bus connections for complex system interfaces.
  • Family-level High-speed Serial Support:  ECP3 family SERDES capabilities support a wide range of serial protocols and data rates up to 3.2 Gbps for scalable link implementations.
  • Commercial-Grade Operation:  Designed for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial product deployments.

Why Choose LFE3-95E-7FN484C?

The LFE3-95E-7FN484C delivers a balanced combination of high logic density, substantial embedded memory, and a large I/O count in a compact 484-ball BGA package. It is positioned for designers who need to integrate DSP functions, sizable on-chip buffering, and flexible high-speed I/O in commercial systems.

As part of the Lattice ECP3 family, this device is suitable for customers looking for scalable FPGA resources with family-level features such as advanced DSP slices and SERDES support, enabling streamlined design reuse and reliable product evolution.

Request a quote or submit a purchase inquiry for the LFE3-95E-7FN484C to get pricing and availability information.

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