LFE3-95E-7FN672I

The LFE3-95E-7FN672I is an ECP3-series FPGA from Lattice Semiconductor, built on the LatticeECP3 architecture. It delivers a flexible, reconfigurable fabric with 92,000 logic elements and approximately 4.53 Mbits of embedded memory, targeting high-performance communications, video, and data-acquisition designs.

Packaged in a 672-ball BGA (27 × 27 mm) with 380 user I/Os, the device operates over an industrial temperature range and supports a low-voltage core supply, enabling dense integration in systems that require robust I/O, DSP capability, and on-chip memory.

Key Features

• Logic Capacity  92,000 logic elements for substantial on-chip logic integration and complex system functions.
• Embedded Memory  4,526,080 bits of on-chip RAM (approximately 4.53 Mbits) to support buffering, frame storage, and local data processing.
• High-Density I/O & Package  380 user I/Os in a 672-BBGA (672-FPBGA, 27×27 mm) package for broad interface connectivity in space-constrained designs.
• Industrial Operating Range  Rated for operation from -40°C to 100°C, suitable for industrial environments requiring extended temperature tolerance.
• Low-Voltage Core Supply  Designed for a core supply range of 1.14 V to 1.26 V (1.2 V core supply noted in family data), enabling modern low-voltage system architectures.
• Embedded SERDES and High-Speed Interfaces  Family-level SERDES support with data rates from 150 Mbps to 3.2 Gbps and multi-protocol capability for high-speed serial links and protocol bridging.
• Enhanced DSP and sysDSP Slices  Cascadable sysDSP architecture for high-performance multiply-accumulate operations suitable for signal processing tasks.
• Flexible sysI/O Buffering  Programmable I/O buffers and wide-ranging interface support (LVTTL, LVCMOS, LVDS, SSTL, HSTL and others) for connectivity to diverse peripherals and memory types.
• Configuration and System Support  Flexible configuration options including SPI boot and dual-boot images, plus family tools and utilities referenced in the device datasheet for design and debug.

Typical Applications

• High-Speed Networking  Implements protocol interfaces and packet processing for 1GbE, XAUI, SGMII and other serial/parallel networking standards using the device's SERDES and abundant I/O.
• Video and Broadcast Systems  Supports video transport and processing pipelines (including SMPTE 3G) with on-chip memory and DSP resources for frame buffering and real-time processing.
• Data Acquisition and ADC/DAC Interfaces  Interfaces to high-speed ADC/DAC devices with dedicated source-synchronous I/O support and on-chip RAM for sample buffering and preprocessing.
• Industrial and Embedded Control  Delivers logic, DSP, and I/O density for motor control, industrial communication bridges, and advanced sensor aggregation within an industrial temperature window.

Unique Advantages

• Highly Integrated Solution: 92,000 logic elements and approximately 4.53 Mbits of on-chip RAM reduce the need for external logic and memory, simplifying board-level BOM and layout.
• Extensive I/O in Compact Package: 380 user I/Os in a 27 × 27 mm 672-BBGA package provide broad connectivity without a large footprint.
• Adaptable High-Speed Links: Embedded SERDES and programmable sysI/O enable multi-protocol serial links and flexible parallel interfaces to meet diverse system requirements.
• DSP-Ready Fabric: sysDSP slices and wide multiplier resources support high-performance signal processing tasks directly on-chip.
• Industrial Reliability: Specified operation from -40°C to 100°C and RoHS compliance support deployment in industrial environments.
• Low-Voltage Compatibility: Narrow core supply range (1.14–1.26 V) aligns with modern low-voltage system designs.

Why Choose LFE3-95E-7FN672I?

The LFE3-95E-7FN672I brings a balance of logic density, on-chip memory, DSP capability, and high-density I/O in a compact BGA package, making it suitable for designs that require substantial integration of processing, buffering, and high-speed interfaces. Its industrial temperature rating and RoHS compliance make it appropriate for demanding embedded and communications applications.

Supported by the LatticeECP3 family feature set and associated design utilities referenced in the device documentation, this part is appropriate for engineers building scalable, high-throughput systems that benefit from integrated serial links, flexible I/O standards, and on-chip signal-processing resources.

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