LFE3-95E-8FN484C

The LFE3-95E-8FN484C is an ECP3 Field Programmable Gate Array (FPGA) IC that combines high logic density, substantial on-chip memory, and a large I/O count in a compact BGA package. It is offered as a commercial-grade, surface-mount device designed for applications that require extensive programmable logic, embedded memory, and flexible interfacing.

Key attributes include 92,000 logic elements, approximately 4.53 Mbits of embedded memory, and up to 295 I/O pins, all powered by a low-voltage supply range of 1.14 V to 1.26 V. The device is RoHS compliant and specified for operation from 0 °C to 85 °C.

Key Features

• Core Logic  Provides 92,000 logic elements to implement complex custom logic, parallel processing, and glue-logic functions.
• Embedded Memory  Approximately 4.53 Mbits of on-chip RAM for buffering, lookup tables, and state storage without relying on external memory.
• I/O Density  Up to 295 external I/O pins to support rich interfacing and multiple peripheral connections.
• Power  Operates from a 1.14 V to 1.26 V supply, enabling integration into low-voltage system domains.
• Package & Mounting  Available in a 484-BBGA footprint; supplier device package listed as 484-FPBGA (23×23). Surface-mount construction supports standard PCB assembly flows.
• Operating Conditions & Grade  Commercial-grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant for reduced hazardous substance content.

Typical Applications

• High-density logic and custom processing  Implement complex finite state machines, datapath logic, and parallel processing using 92,000 logic elements.
• I/O-rich interface bridging  Use the device’s 295 I/O pins to aggregate and translate signals between multiple subsystems or peripherals.
• Embedded memory functions  Leverage approximately 4.53 Mbits of on-chip RAM for packet buffering, LUT-based lookups, and temporary data storage.
• Compact system-level integration  The 484-BBGA (484-FPBGA 23×23) package supports dense board layouts where footprint and routing efficiency are important.

Unique Advantages

• Highly integrated logic resources: 92,000 logic elements reduce the need for multiple discrete devices and simplify board-level design.
• Substantial on-chip memory: Approximately 4.53 Mbits of embedded RAM enables local buffering and state retention without immediate external memory dependencies.
• Extensive I/O capacity: 295 I/O pins provide flexibility for multi-interface designs and complex peripheral connectivity.
• Low-voltage operation: The 1.14 V to 1.26 V supply range aligns with modern low-voltage power domains for efficient system integration.
• Compact SMD package: 484-BBGA / 484-FPBGA (23×23) supports high-density PCB layouts and standard surface-mount assembly.
• RoHS-compliant, commercial grade: Conforms to environmental requirements and intended for commercial temperature-range applications.

Why Choose LFE3-95E-8FN484C?

The LFE3-95E-8FN484C positions itself as a balanced FPGA solution offering a combination of high logic capacity, meaningful on-chip memory, and a large I/O complement in a compact package. Its electrical and thermal specifications—1.14 V to 1.26 V supply and 0 °C to 85 °C operating range—make it suitable for commercial electronic designs that require dense programmable logic and flexible interfacing while maintaining RoHS compliance.

This device is well suited for engineering teams and procurement organizations designing systems that demand substantial programmable resources, embedded RAM, and extensive I/O in a surface-mount 484-BBGA form factor. Its specification set supports scalable designs where integration and footprint efficiency matter.

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