LFE3-95E-8FN484I

The LFE3-95E-8FN484I is an industrial-grade ECP3 field programmable gate array from Lattice Semiconductor Corporation. It delivers a high-density logic fabric with 92,000 logic elements and approximately 4.53 Mbits of on-chip RAM, designed for embedded and system-level digital designs.

With up to 295 user I/Os, a 484-ball BBGA package, and a narrow supply range of 1.14 V to 1.26 V, this device targets applications that require substantial logic and memory integration within an industrial operating temperature window of −40 °C to 100 °C.

Key Features

• Core Logic Resources  92,000 logic elements provide a large programmable fabric; the device also lists 11,500 LABs/CLBs for architecture-level resource planning.
• Embedded Memory  Approximately 4.53 Mbits of on-chip RAM for data buffering, state storage, and local memory requirements.
• I/O Capacity  Up to 295 user I/Os to support wide peripheral and subsystem interfacing within a single device.
• Power Supply  Supported supply range of 1.14 V to 1.26 V for the core, enabling predictable power budgeting in system designs.
• Package & Mounting  484-ball BBGA package (supplier package: 484-FPBGA, 23 × 23) in a surface-mount form factor for compact board-level implementation.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
• Regulatory Compliance  RoHS compliant to support environmentally regulated manufacturing and supply chains.

Typical Applications

• Industrial Control Systems  Industrial-grade temperature rating and robust I/O count make this FPGA suitable for automation and control equipment that needs reliable logic and memory integration.
• High-Density Logic Implementations  Large logic element count supports complex state machines, protocol handling, and custom processing engines within a single device.
• Embedded Memory-Intensive Designs  Approximately 4.53 Mbits of embedded RAM provides local storage for buffering and temporary data handling in embedded systems.

Unique Advantages

• High integration density: 92,000 logic elements and substantial on-chip RAM reduce the need for external logic and memory components.
• Broad I/O support: 295 available I/Os enable consolidation of multiple interfaces and peripherals onto one FPGA.
• Industrial-ready thermal range: Specified operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact surface-mount package: 484-BBGA (23 × 23) allows high-density board layouts while maintaining a standardized supplier package format.
• Controlled core voltage: Narrow supply window (1.14 V to 1.26 V) supports predictable power design and margining.
• RoHS compliance: Simplifies integration into environmentally regulated products and supply chains.

Why Choose LFE3-95E-8FN484I?

The LFE3-95E-8FN484I combines a large programmable logic resource pool with multi-megabit embedded memory and a high I/O count in a compact BBGA package, positioned for industrial applications that require reliable, dense FPGA integration. Its specified operating temperature range and RoHS compliance make it suitable for long-life, regulated product lines.

This device is well suited for engineers designing complex digital systems that need on-chip memory, plentiful I/O, and a substantial number of logic elements—providing a scalable platform for consolidated designs with predictable power and thermal characteristics.

Request a quote today to evaluate the LFE3-95E-8FN484I for your next design or submit a quote request to receive pricing and availability information.