LFE3-95EA-6FN1156I

The LFE3-95EA-6FN1156I is a Lattice ECP3 family field-programmable gate array (FPGA) in a 1156-BBGA surface-mount package. It delivers a balance of programmable logic, embedded memory and advanced I/O capability for high-volume, high-speed, cost-sensitive applications.

Built on the LatticeECP3 architecture, the device targets system designs requiring substantial logic capacity, flexible I/O, DSP resources and system-level clocking and configuration features while operating across an industrial temperature range.

Key Features

• Logic Capacity  Approximately 92,000 logic elements (cells) to implement complex state machines, protocol logic and custom accelerators.
• Embedded Memory  Total on-chip RAM of 4,526,080 bits (approximately 4.53 Mbits) for buffering, lookup tables and data storage.
• High I/O Count  Up to 490 user I/Os provided in the 1156-BBGA package for dense board-level interfacing and peripheral connectivity.
• Family SERDES Support  LatticeECP3 family devices include embedded SERDES with supported data rates from 150 Mbps to 3.2 Gbps for serial links and protocol implementations.
• sysDSP and DSP Resources  Family-level sysDSP architecture provides multiply–accumulate capabilities and dedicated multiplier resources for signal processing and math-intensive tasks.
• Clocking and Timing  Family devices offer programmable PLLs and DLLs (two DLLs and up to ten PLLs per device) to support flexible clock management and high-performance timing architectures.
• Power Supply  Core voltage supply range specified from 1.14 V to 1.26 V for the device core.
• Package and Mounting  Surface-mount 1156-FPBGA (35 × 35 mm) package suited for compact board layouts and high-density designs.
• Industrial Temperature Grade  Rated for operation from −40 °C to +100 °C for use in industrial applications.
• Standards and Configuration  Family-level features include flexible device configuration options such as SPI boot flash interface, dual-boot images and system configuration utilities.
• RoHS Compliant  Device is RoHS compliant.

Typical Applications

• Network and Communications  Implement protocol offload, packet processing and serial link interfacing leveraging family SERDES and high I/O counts.
• Industrial Control  Perform motor control, I/O aggregation and deterministic control logic within an industrial temperature-rated FPGA.
• Video and Imaging  Use embedded memory and DSP resources for buffering, scaling and pixel processing pipelines.
• High-Performance Embedded Systems  Integrate custom accelerators, glue logic and memory interfaces for compact system designs requiring programmable hardware.

Unique Advantages

• Substantial Logic and Memory in a Single Device: Approximately 92K logic elements and ~4.53 Mbits of embedded RAM reduce the need for external logic and memory components.
• Flexible I/O for Dense Connectivity: Up to 490 user I/Os in a 1156-BBGA package support complex board-level interfacing and multiple parallel or serial buses.
• Designed for High-Speed SerDes and DSP Tasks: Family SERDES capability (150 Mbps–3.2 Gbps) and sysDSP resources enable high-speed serial links and efficient signal processing implementations.
• Industrial Temperature Range: −40 °C to +100 °C rating allows deployment in industrial environments where extended temperature operation is required.
• Configurable Clocking and System Support: Multiple PLLs/DLLs and flexible configuration options facilitate complex timing architectures and field updates.
• RoHS Compliance: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose LFE3-95EA-6FN1156I?

The LFE3-95EA-6FN1156I brings the LatticeECP3 family capabilities—large programmable logic capacity, significant on-chip memory and comprehensive I/O—to applications that demand integration, configurability and industrial-temperature operation. It fits designs that require a balance of DSP-aware resources, high I/O density and family-level high-speed serial support.

This device is well suited to engineering teams building high-volume, high-speed, cost-sensitive systems where on-chip resources, flexible configuration and robust clocking support reduce BOM complexity and speed time-to-market.

Request a quote or submit a purchase inquiry to evaluate LFE3-95EA-6FN1156I for your designs.