LFE3-95EA-6FN672I

The LFE3-95EA-6FN672I is an ECP3 Field Programmable Gate Array (FPGA) IC offered in a 672-ball BBGA package. It provides a high-density programmable logic fabric with abundant I/O, embedded memory, and industrial-grade operating range for system designs that require flexible hardware customization.

Key attributes include approximately 92,000 logic elements, roughly 4.5 Mbits of embedded RAM, 380 I/O pins, and a 672-BBGA surface-mount package, making this device suitable for robust embedded and industrial applications where integration and reliability matter.

Key Features

• Core Logic Approximately 92,000 logic elements provide significant programmable logic capacity for complex designs.
• Configurable Logic Blocks (CLBs) 11,500 CLB units reported for structured logic partitioning and design mapping.
• Embedded Memory Approximately 4.5 Mbits of on-chip RAM to support buffering, lookup tables, and data storage within the FPGA fabric.
• I/O Density 380 I/O pins to connect with peripherals, sensors, and external subsystems without extensive external glue logic.
• Power Supply Supported core voltage range from 1.14 V to 1.26 V to match system power rails and power-management strategies.
• Package & Mounting 672-BBGA (supplier package: 672-FPBGA, 27×27) in a surface-mount configuration for compact PCB integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Environmental Compliance RoHS compliant, meeting common environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Industrial-grade temperature rating and robust logic capacity make this FPGA suitable for motor control, PLCs, and factory automation tasks.
• I/O-Intensive Systems — With 380 I/Os, the device supports applications that require extensive external connectivity such as sensor aggregation and multi-interface controllers.
• Embedded Memory-Dependent Designs — Approximately 4.5 Mbits of embedded RAM supports buffering, packet processing, and on-chip data handling in communication and signal processing modules.
• Space-Constrained PCB Designs — The 672-BBGA surface-mount package provides a high-density solution for compact boards where board area is limited.

Unique Advantages

• High Logic Capacity: Approximately 92,000 logic elements enable implementation of complex custom logic without immediate need for multiple devices.
• Substantial On-Chip Memory: Roughly 4.5 Mbits of embedded RAM reduces reliance on external memory, simplifying BOM and board layout.
• Extensive I/O: 380 I/O pins accommodate multiple interfaces and peripheral connections, lowering the need for additional I/O expanders.
• Industrial-Rated Operation: Operation from −40 °C to 100 °C supports deployment in demanding environments common to industrial applications.
• Compact, Surface-Mount Package: The 672-BBGA (27×27) package allows high-density integration for space-limited designs.
• Regulatory Compliance: RoHS compliance aligns the device with common environmental manufacturing standards.

Why Choose LFE3-95EA-6FN672I?

The LFE3-95EA-6FN672I delivers a balance of high logic density, substantial embedded memory, and wide I/O capacity in a compact surface-mount BBGA package. Its industrial temperature rating and RoHS compliance make it a dependable choice for embedded systems and industrial projects that demand on-board flexibility and reliable operation.

This FPGA is well suited for engineers and procurement teams building scalable, integration-focused designs that benefit from significant on-chip resources and robust environmental tolerance. The combination of logic, memory, and I/O on a single device helps reduce system complexity and can shorten development cycles.

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