LFE3-95EA-6FN484I

The LFE3-95EA-6FN484I is an ECP3 family FPGA from Lattice Semiconductor designed for high-density, reconfigurable logic integration. It provides 92,000 logic elements, approximately 4.53 Mbits of on-chip RAM, and 295 user I/Os in a 484‑BBGA (23 × 23 mm) surface-mount package.

Built for industrial-grade applications, this device combines a compact package, embedded memory and DSP resources, and multi‑Gbps SERDES capability to address networking, communications, and high-performance embedded systems.

Key Features

• Logic Capacity – 92,000 logic elements for complex control, signal processing, and protocol implementation.
• Embedded Memory – Total on-chip RAM of 4,526,080 bits, providing approximately 4.53 Mbits of embedded memory for buffering, FIFOs, and state storage.
• DSP and Arithmetic – ECP3 family sysDSP architecture with dedicated multiplier resources (device-level: 128 18×18 multipliers) for multiply-accumulate and DSP functions.
• High‑Speed Serial IO (SERDES) – Embedded SERDES supporting data rates from 150 Mbps to 3.2 Gbps and multiple channels per device for high-speed serial protocols.
• Extensive I/O – 295 user I/Os with programmable I/O buffer support for a broad set of parallel and differential standards.
• Package and Mounting – 484‑BBGA (supplier package: 484‑FPBGA, 23 × 23 mm) surface-mount package for dense board-level integration.
• Power and Thermal – Core supply range 1.14 V to 1.26 V and industrial operating temperature range of −40 °C to 100 °C.
• Configuration and System Support – Flexible device configuration options in the ECP3 family including SPI boot flash interface, dual-boot images, and on-chip oscillator; family-level tools include Reveal Logic Analyzer and ORCAstra configuration utility.
• Compliance – RoHS‑compliant device.

Typical Applications

• Telecommunications & Networking: Implementation of PCI Express, Ethernet (1GbE, SGMII, XAUI), Serial RapidIO, and other high-speed interfaces using on-chip SERDES channels and extensive I/O.
• Broadcast & Video Transport: Support for SMPTE 3G and SONET/SDH applications where multi‑Gbps serial links and embedded memory are required for buffering and timing.
• Wireless & Fronthaul: CPRI and other radio‑interface protocols leveraging SERDES and DSP resources for data transport and preprocessing.
• High‑Performance Embedded Systems: DSP‑intensive control, signal processing, and custom protocol logic using 18×18 multipliers and abundant logic elements.

Unique Advantages

• High Logic Density: 92,000 logic elements enable complex system integration and consolidation of multiple functions into a single device.
• Substantial On‑Chip Memory: Approximately 4.53 Mbits of embedded RAM reduce external memory dependence and simplify data buffering and packet handling.
• Integrated DSP Resources: 128 18×18 multipliers support efficient implementation of MAC-heavy algorithms and signal-processing chains.
• Multi‑Gbps Serial Connectivity: Embedded SERDES support data rates up to 3.2 Gbps for high-speed serial protocols, enabling modern network and transport interfaces.
• Industrial Temperature Range: −40 °C to 100 °C operation for deployment in industrial and ruggedized environments.
• Compact, High‑Pin Package: 484‑BBGA (23 × 23 mm) provides a balance of I/O count (295) and board space efficiency for dense designs.

Why Choose LFE3-95EA-6FN484I?

The LFE3-95EA-6FN484I delivers a balanced combination of logic density, embedded memory, DSP capability, and high-speed serial interfaces in a single industrial-grade FPGA package. It is suited to designs that require consolidated system functions, real-time signal processing, and multiple high-speed links while maintaining a compact board footprint.

For engineering teams targeting networking, broadcast, wireless fronthaul, or advanced embedded systems, this device offers the on-chip resources and family-level configuration tools to accelerate development and deployment while providing the scalability and integration typical of the Lattice ECP3 family.

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