LFE3-95EA-6FN672C

The LFE3-95EA-6FN672C is a commercial-grade Lattice ECP3 family field programmable gate array (FPGA) offered in a 672-ball BGA package. It delivers a high-density programmable fabric with 92,000 logic elements, approximately 4.53 Mbits of on-chip RAM, and 380 user I/Os, making it suitable for applications that require substantial logic capacity, flexible I/O, and embedded memory in a compact surface-mount package.

Key Features

• Core Logic  92,000 logic elements provide a high level of logic density for integration of complex digital functions.
• Embedded Memory  Approximately 4.53 Mbits of total on-chip RAM for data buffering, packet handling, and local storage.
• sysDSP and DSP Acceleration  Family-level sysDSP architecture supports cascaded slices and high-performance multiply–accumulate operations for signal processing tasks.
• High‑Speed Serial I/O  Embedded SERDES support and family-level data rates up to 3.2 Gbps enable implementation of common serial protocols and multi-channel links.
• Programmable I/O Standards  Flexible sysI/O buffer options support diverse interfaces (LVTTL, LVCMOS, SSTL, HSTL, LVDS and related differential/bus standards) for easy system integration.
• Package & Mounting  672-ball FPBGA (27 × 27 mm) supplier package, surface mount mounting type, providing a compact, board-level integration option.
• Power  Core supply voltage specified at 1.14 V to 1.26 V for targeted power-domain design.
• Operating Range & Compliance  Commercial operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Networking & Telecom  High-density logic and embedded SERDES enable implementation of Ethernet, PCI Express, CPRI and other serial-link endpoints and bridges.
• Video & Broadcast  Support for high-speed serial interfaces such as SMPTE 3G and flexible I/O standards make this device suitable for video transport and format conversion tasks.
• High-Speed Data Acquisition  On-chip RAM, sysDSP capabilities, and source-synchronous I/O support make the device suitable for ADC/DAC interfacing and real-time data processing.
• Embedded System Integration  Large logic capacity and flexible I/O standards enable board-level consolidation of glue logic, protocol translation, and custom peripherals.

Unique Advantages

• High Logic Density:  92,000 logic elements allow substantial integration of custom logic and control functions, reducing external component count.
• Integrated Memory Resources:  Approximately 4.53 Mbits of embedded RAM supports buffering and local data storage without immediate need for external memory.
• Flexible I/O Ecosystem:  Programmable I/O standards and embedded SERDES simplify interfacing to a wide range of parallel and serial peripherals.
• Compact Surface-Mount Package:  672-ball FPBGA (27 × 27 mm) footprint balances I/O count and board space for dense designs.
• Commercial Temperature and RoHS Compliance:  Rated for 0 °C to 85 °C operation and RoHS-compliant manufacturing for mainstream electronics applications.
• Low-Voltage Core:  Core supply range of 1.14 V to 1.26 V supports modern low-voltage power domains.

Why Choose LFE3-95EA-6FN672C?

The LFE3-95EA-6FN672C positions itself as a high-density, versatile FPGA for designers who need substantial logic capacity, embedded memory, and flexible I/O in a compact surface-mount package. With 92,000 logic elements, about 4.53 Mbits of on-chip RAM, embedded SERDES capabilities, and broad I/O standard support, it is well-suited for communications, video, data-acquisition, and embedded system integration projects developed for commercial temperature environments.

Customers benefit from a platform that balances integration and performance while maintaining RoHS compliance and a manageable core-voltage domain. The part is appropriate for design teams looking to consolidate functions, implement high-speed serial links, and leverage DSP-oriented resources available in the ECP3 family.

Request a quote or submit an inquiry to receive pricing, availability, and assistance integrating the LFE3-95EA-6FN672C into your next design.