LFE3-95EA-6LFN484C

The LFE3-95EA-6LFN484C is a Field Programmable Gate Array (FPGA) from the ECP3 family, offering a high-density programmable fabric with extensive I/O and embedded memory. Designed for commercial-grade applications, it delivers a combination of large logic capacity, substantial on-chip RAM, and a high I/O count in a 484-ball BGA package.

This device is suited for designs that require dense logic integration, significant buffering or packet storage, and flexible signal interfacing while operating within standard commercial temperature and low-voltage supply ranges.

Key Features

• Logic Capacity — Provides 92,000 logic elements for implementing complex custom logic, state machines, and parallel compute functions.
• Embedded Memory — Approximately 4.53 Mbits of on-chip RAM to support data buffering, frame/packet storage, and local scratchpad memory without external RAM.
• I/O Density — 295 general-purpose I/O pins enable high-density peripheral interfacing, multi-protocol bridging, and extensive sensor or port connectivity.
• Power Supply Range — Operates from 1.14 V to 1.26 V, allowing integration into low-voltage system rails and power-optimized designs.
• Package & Mounting — Supplied in a 484-ball BGA (484-FPBGA, 23×23) package with surface-mount mounting for compact board designs and reliable solder attachment.
• Temperature & Grade — Commercial grade operation from 0 °C to 85 °C, suitable for standard consumer and business applications.
• Regulatory Compliance — RoHS compliant, supporting lead-free manufacturing and regulatory requirements for many global markets.

Typical Applications

• High-density I/O interfacing — Use the 295 I/Os to connect multiple sensors, peripherals, or interface standards in compact system architectures.
• Custom logic and protocol bridging — Implement protocol converters, custom state machines, and glue logic leveraging the 92,000 logic elements.
• On-chip buffering and packet processing — Utilize approximately 4.53 Mbits of embedded memory for temporary data storage, buffering, and stream handling without external memory.
• Embedded control and pre-processing — Deploy local signal conditioning, control loops, and pre-processing functions within a single programmable device.

Unique Advantages

• High logic density: 92,000 logic elements enable consolidation of multiple discrete functions into one programmable chip, reducing board-level part count.
• Substantial on-chip RAM: Approximately 4.53 Mbits of embedded memory minimizes dependency on external RAM for many buffering and staging tasks.
• Large I/O complement: 295 I/Os provide flexibility for complex interfacing, minimizing the need for external I/O expanders.
• Compact BGA packaging: The 484-ball FPBGA (23×23) package supports a small PCB footprint while maintaining high signal density.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronics manufacturing and deployment.
• Low-voltage operation: 1.14 V to 1.26 V supply range aligns with modern low-power system designs and power rails.

Why Choose LFE3-95EA-6LFN484C?

The LFE3-95EA-6LFN484C positions itself as a high-density, commercially rated FPGA for developers who need a balance of large logic capacity, meaningful on-chip RAM, and extensive I/O in a compact BGA footprint. Its specifications make it well suited to consolidate complex logic, buffering, and interfacing tasks onto a single device, simplifying board design and reducing component count.

Design teams targeting scalable, reliable programmable solutions for consumer and business applications will find long-term value in the LFE3-95EA-6LFN484C’s combination of integration, RoHS compliance, and commercial temperature operation.

Request a quote or submit an RFQ today to evaluate the LFE3-95EA-6LFN484C for your next design.