LFE3-95EA-6LFN672I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 380 4526080 92000 672-BBGA |
|---|---|
| Quantity | 1,159 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 380 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11500 | Number of Logic Elements/Cells | 92000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-95EA-6LFN672I – ECP3 Field Programmable Gate Array (FPGA) IC 380 4526080 92000 672-BBGA
The LFE3-95EA-6LFN672I is an ECP3 series field-programmable gate array from Lattice Semiconductor Corporation. It provides a high-capacity programmable logic fabric with a large number of I/Os and embedded memory, delivered in a compact 672-BBGA package for surface-mount assembly.
Designed for industrial-grade deployments, this device combines 92,000 logic elements, approximately 4.53 Mbits of on-chip RAM, and 380 user I/Os, operating over a supply range of 1.14–1.26 V and an ambient temperature range of −40 °C to 100 °C.
Key Features
- Logic Capacity 92,000 logic elements provide substantial programmable logic resources for complex designs.
- Embedded Memory Approximately 4.53 Mbits of on-chip RAM to support buffering, lookup tables, and state storage.
- I/O Resources 380 device I/Os enable broad connectivity to peripherals, sensors, and external logic.
- Power Nominal core supply range of 1.14 V to 1.26 V for core power planning and regulation.
- Package & Mounting 672-ball BGA (672-BBGA / 672-FPBGA 27×27) in a surface-mount format for high-density PCB implementations.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
- Regulatory Compliance RoHS-compliant construction supporting restriction of hazardous substances.
Unique Advantages
- High logic density: 92,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
- Substantial embedded memory: Approximately 4.53 Mbits of RAM supports larger buffers and on-chip data structures, improving system responsiveness.
- Extensive I/O count: 380 I/Os provide flexibility for interfacing to numerous peripherals and parallel external devices without additional I/O expanders.
- Industrial-ready thermal range: −40 °C to 100 °C rating supports deployment in temperature-demanding environments.
- Compact BGA package: 672-ball FPBGA (27×27) offers a high-pin-count solution in a space-efficient footprint suitable for dense PCBs.
- RoHS compliant: Meets RoHS requirements for environmentally conscious manufacturing and procurement.
Why Choose LFE3-95EA-6LFN672I?
The LFE3-95EA-6LFN672I positions itself as a high-capacity, industrial-grade FPGA option that balances logic density, embedded memory, and I/O availability in a compact BGA package. Its operating voltage window and wide temperature rating make it appropriate for demanding embedded applications where on-chip resources and reliability matter.
Backed by Lattice Semiconductor Corporation, this device is suited for designers who need significant programmable logic and memory integration in a surface-mount form factor, with a focus on long-term deployable designs in industrial environments.
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