LFE3-95EA-7FN1156I

The LFE3-95EA-7FN1156I is an ECP3 family field programmable gate array from Lattice Semiconductor Corporation. It provides a dense fabric of programmable logic for industrial applications, offering a balance of logic capacity, on-chip memory, and large I/O count in a compact BGA package.

Designed for surface-mount assembly, the device targets industrial systems that require up to 92,000 logic elements, roughly 4.53 Mbits of embedded memory, and up to 490 I/O pins while operating across a -40 °C to 100 °C temperature range.

Key Features

• Core Logic — 92,000 logic elements for implementing complex programmable logic and custom processing functions.
• Embedded Memory — Approximately 4.53 Mbits of on-chip RAM to support buffers, FIFOs, and on-chip data storage.
• I/O Density — Up to 490 I/O pins to support broad peripheral, bus, and interface connectivity needs.
• Power — Core voltage supply range of 1.14 V to 1.26 V for the device core power domain.
• Package and Mounting — 1156-BBGA package (Supplier device package: 1156-FPBGA, 35×35 mm) in a surface-mount form factor suited to compact board designs.
• Industrial Temperature Range — Specified for operation from -40 °C to 100 °C for industrial-grade deployments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Programmable logic and abundant I/O support control, monitoring, and interface aggregation in industrial systems within the specified temperature range.
• Embedded Processing — On-chip memory and large logic capacity enable custom embedded data-paths, protocol handling, and peripheral glue logic.
• Communications and I/O Aggregation — High I/O count and significant logic resources suit protocol bridging, buffering, and interface conversion tasks.

Unique Advantages

• High Logic Capacity: 92,000 logic elements allow implementation of sizeable custom logic functions without external ASICs.
• Substantial On-chip Memory: Approximately 4.53 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O: Up to 490 I/Os provide flexibility to connect multiple peripherals, buses, and interfaces directly to the FPGA fabric.
• Industrial Temperature Support: -40 °C to 100 °C rating supports deployment in industrial environments.
• Compact BGA Packaging: 1156-BBGA (35×35 mm FPBGA) balances high pin-count integration with a board-space-efficient footprint for surface-mount assembly.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose LFE3-95EA-7FN1156I?

The LFE3-95EA-7FN1156I positions itself as a high-capacity ECP3 FPGA option from Lattice Semiconductor Corporation that combines large logic resources, significant embedded RAM, and a high I/O count in a single surface-mount BGA package rated for industrial temperatures. Its core voltage range and package dimensions make it suitable for compact, industrial-grade designs that require on-board programmable logic and extensive interfacing.

This device is well suited for engineers and procurement teams building industrial control, embedded processing, and communications hardware who need a robust, verifiable FPGA platform from an established manufacturer.

Request a quote or submit a procurement inquiry to begin the ordering process for the LFE3-95EA-7FN1156I.