LFE3-95EA-7FN672C

The LFE3-95EA-7FN672C is a commercial-grade FPGA from the LatticeECP3 family, offering a reconfigurable logic fabric optimized for high-performance, cost-sensitive designs. Built for system integration, this device combines a large logic capacity, on-chip memory, high-speed I/O capability and family-level DSP/SERDES resources to address networking, communication and general embedded applications.

This device is supplied in a 672-ball fine-pitch BGA (27 × 27 mm) surface-mount package, supports a 1.14 V to 1.26 V core supply and operates across a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity — Approximately 92,000 logic elements for implementing complex programmable logic and glue functions.
• Embedded Memory — Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) to support buffering, state storage and on-chip data structures.
• High I/O Count — 380 user I/Os in the 672-BBGA package to support wide parallel interfaces and multi-channel connectivity.
• Embedded SERDES (family capability) — LatticeECP3 family supports embedded SERDES with data rates from 150 Mbps to 3.2 Gbps; the 672 package maps to the family configuration providing multi-channel SERDES capability alongside the 380 I/Os.
• sysDSP and Multipliers — Family-level DSP architecture with dedicated multiply-accumulate slices; ECP3-95 family devices include 128 18×18 multipliers for signal processing tasks.
• Clocking Resources — Device-level PLLs and DLLs (family data indicates up to 10 PLLs and 2 DLLs for this device class) for flexible clock generation and domain management.
• Flexible I/O Standards — Family supports a wide range of programmable I/O standards and on-chip termination options for interfacing with diverse peripherals and memory types.
• Package & Mounting — 672-ball FPBGA (27 × 27 mm) surface-mount package (supplier device package: 672-FPBGA) for compact board-level integration.
• Power & Temperature — Core voltage range 1.14 V to 1.26 V; commercial operating temperature 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-Speed Networking — Implement line cards, PHY bridging and protocol framing where multi‑lane SERDES and high I/O counts are required.
• Serial Protocol Interfaces — Ideal for systems requiring protocol support such as PCI Express, Ethernet variants, CPRI and other serial links supported by the ECP3 family SERDES.
• Embedded Signal Processing — Leverage sysDSP slices and dedicated multipliers for DSP tasks such as filtering, data aggregation and real‑time processing.
• Memory Interface and Buffering — Use on-chip RAM and source-synchronous I/O features for DDR/DDR2/DDR3 memory interfaces and high-throughput buffering.

Unique Advantages

• High Logic Density: ~92,000 logic elements enable complex system-on-FPGA functions and consolidation of multiple discrete components.
• Integrated Memory Resources: Approximately 4.53 Mbits of embedded RAM reduces the need for external buffering and lowers BOM complexity.
• Broad I/O and SERDES Capability: 380 I/Os and family SERDES support allow flexible connectivity for multi-protocol designs and high-speed links.
• Scalable DSP Performance: Dedicated multipliers and sysDSP architecture provide deterministic arithmetic resources for signal-processing workloads.
• Compact, Surface-Mount Package: 672-ball FPBGA (27×27 mm) balances I/O density and PCB area for space-constrained systems.
• Commercial Grade with RoHS Compliance: Suitable for mainstream embedded and communications products where commercial temperature range and lead‑free compliance are required.

Why Choose LFE3-95EA-7FN672C?

The LFE3-95EA-7FN672C positions itself where system integration and performance meet economical design goals. With substantial logic capacity, multi-megabit on-chip RAM and high I/O density in a compact 672-BBGA package, it suits designs that require on-board processing, multi-channel I/O and high-speed serial links while keeping board-level complexity and part count down.

This device is a fit for engineering teams building high-volume, high-throughput embedded systems, communication endpoints and interface bridges who need proven family-level DSP and SERDES capabilities together with flexible clocking and I/O support.

Request a quote or submit an inquiry to obtain pricing, lead-time and volume availability for LFE3-95EA-7FN672C. Our team can provide ordering information and support for technical evaluation and deployment.