LFE3-95EA-7LFN1156C

The LFE3-95EA-7LFN1156C is a commercial-grade ECP3 family FPGA in a 1156-ball BGA package optimized for high-density, high-throughput integration. Built on the LatticeECP3 architecture, it delivers 92,000 logic elements, approximately 4.526 Mbits of on-chip RAM, and 490 user I/Os to support complex logic, memory and high-speed serial interfaces in volume designs.

This device targets applications that require a balance of programmable logic, embedded memory, DSP capabilities and multi-protocol serial connectivity while operating from a 1.14 V to 1.26 V core supply across a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic  92,000 logic elements providing substantial LUT capacity for system integration; device-level count also lists 11,500 CLBs for hierarchical resource planning.
• Embedded Memory  Approximately 4.526 Mbits of on-chip RAM (total RAM bits = 4,526,080) for frame buffers, FIFOs and scratch memory; family architectures support larger sysMEM capacities where needed.
• DSP Resources  Family sysDSP architecture supports high-performance multiply and accumulate operations; ECP3-95 offers a significant count of 18×18 multipliers for fixed/floating point DSP tasks.
• High-Speed Serial Interfaces (SERDES)  Embedded SERDES channels in the family support a broad data-rate range (150 Mbps to 3.2 Gbps) and multi-channel protocols including PCI Express, SONET/SDH, Ethernet, CPRI, SMPTE 3G and Serial RapidIO.
• Flexible I/O  490 user I/Os in the 1156-ball package with programmable sysI/O buffer options and a wide set of supported standards for parallel and differential interfaces.
• Clocking and Timing  Family devices include multiple PLLs and DLLs for clock management and source-synchronous interface support to simplify timing across high-speed links.
• Package & Mounting  1156-BBGA (1156-FPBGA, 35×35 mm) surface-mount package providing high I/O density for board-level integration.
• Power & Environmental  1.14 V to 1.26 V core voltage supply and commercial operating temperature range of 0 °C to 85 °C; RoHS compliant.
• Configuration & System Support  Family features include SPI boot flash interfaces, dual-boot capability and system-level utilities for configuration and debug.

Typical Applications

• Network Infrastructure  High-density logic and embedded SERDES make the device suitable for Ethernet, PCI Express and other packet-processing functions in network equipment.
• Broadcast & Video Transport  Support for SMPTE 3G and high-speed serial protocols enables link aggregation, framing and re-timing in video transport and broadcast systems.
• Wireless & Telecom  Multi-channel SERDES and DSP resources support baseband processing, fronthaul/backhaul interfaces and multi-protocol transport.
• High-Speed Data Conversion  Source-synchronous I/O and embedded memory are useful for buffering and interface logic when integrating ADC/DAC or other high-speed converters.

Unique Advantages

• High integration density: Combines 92,000 logic elements with large on-chip RAM to reduce external memory and discrete logic requirements.
• Broad high-speed serial support: Embedded SERDES and family-level protocol support enable multi-gigabit links without external PHYs for many use cases.
• Scalable DSP capability: sysDSP architecture and multiple 18×18 multipliers provide significant arithmetic throughput for signal processing tasks.
• Flexible I/O and packaging: 490 user I/Os in a 1156-ball BGA deliver board-level routing options and high pin count for complex systems.
• Low-voltage core: 1.14 V–1.26 V operation supports modern power architectures and helps manage system-level power consumption.
• Commercial-grade, compliant supply chain: Surface-mount 1156-FPBGA packaging and RoHS compliance simplify manufacturing and regulatory compatibility.

Why Choose LFE3-95EA-7LFN1156C?

The LFE3-95EA-7LFN1156C delivers a balanced combination of dense logic, substantial embedded memory and comprehensive high-speed serial and I/O capabilities in a single commercial-grade FPGA package. It is well suited to designers who need programmable DSP performance and multi-protocol serial connectivity without sacrificing integration density.

For teams building network equipment, broadcast interfaces, telecom systems or data-aggregation devices, this device offers a scalable platform backed by the Lattice ECP3 family architecture and on-chip resources that simplify system-level design and reduce external component count.

Request a quote or contact sales to discuss availability, lead times and volume pricing for LFE3-95EA-7LFN1156C.