LFE3-95EA-7LFN672C

IC FPGA 380 I/O 672FPBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 380 4526080 92000 672-BBGA

Quantity 187 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O380Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11500Number of Logic Elements/Cells92000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-95EA-7LFN672C – ECP3 FPGA, 92,000 Logic Elements, 380 I/Os, 672-BBGA

The LFE3-95EA-7LFN672C is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers 92,000 logic elements and approximately 4.53 Mbits of embedded memory (4,526,080 bits) in a compact surface-mount package.

Designed for mid-density programmable logic applications, this device provides extensive I/O with 380 user pins, a low-voltage supply range of 1.14 V to 1.26 V, and commercial-grade operation from 0 °C to 85 °C.

Key Features

  • Core  ECP3 family FPGA architecture with 92,000 logic elements for implementing complex digital logic functions.
  • Embedded Memory  Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) to support buffering, FIFOs, and local data storage.
  • I/O  380 user I/O pins to support high connectivity and interface aggregation.
  • Power  Low-voltage operation with a supply range of 1.14 V to 1.26 V for designs targeting reduced core power levels.
  • Package & Mounting  672-BBGA package; supplier device package listed as 672-FPBGA (27×27); surface-mount for board-level assembly.
  • Temperature & Grade  Commercial grade operation across 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • I/O-Intensive Embedded Systems  Use the 380 I/Os to connect multiple sensors, interfaces, and peripherals in embedded designs.
  • Custom Logic and Protocol Bridging  Implement protocol translation, glue logic, and custom data paths using 92,000 logic elements and embedded RAM.
  • Prototyping and Development Platforms  Mid-density FPGA prototyping where compact 672-BBGA surface-mount packaging is required on target boards.

Unique Advantages

  • High logic capacity: 92,000 logic elements provide the resources to implement substantial custom digital designs.
  • Substantial on-chip memory: Approximately 4.53 Mbits of embedded RAM reduces dependence on external memory for many designs.
  • Extensive connectivity: 380 I/Os enable flexible interfacing to a wide range of peripherals and subsystems.
  • Compact surface-mount package: 672-BBGA / 672-FPBGA (27×27) packaging supports dense PCB layouts and modern assembly processes.
  • Low-voltage core operation: 1.14 V to 1.26 V supply range supports designs targeting lower core power.
  • RoHS compliant: Meets common environmental restrictions for electronics manufacturing.

Why Choose LFE3-95EA-7LFN672C?

The LFE3-95EA-7LFN672C positions itself as a mid-density, I/O-rich FPGA solution that balances significant logic capacity with on-chip memory and extensive connectivity. Its low-voltage core and compact 672-BBGA surface-mount package make it suitable for board designs where space and power are important considerations.

This device is a fit for engineers and procurement teams seeking a commercial-grade FPGA from Lattice Semiconductor Corporation for designs that require substantial programmable logic, embedded RAM, and high I/O counts, while maintaining RoHS compliance and mainstream operating temperature support.

Request a quote or submit an inquiry for pricing and availability of the LFE3-95EA-7LFN672C to receive detailed lead-time and ordering information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up