LFE3-95EA-7LFN484I

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA

Quantity 673 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11500Number of Logic Elements/Cells92000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-95EA-7LFN484I – ECP3 Field Programmable Gate Array, 92k Logic Elements, 295 I/Os, 484-BBGA

The LFE3-95EA-7LFN484I is an ECP3 FPGA IC from Lattice Semiconductor Corporation, offering a high count of programmable logic and on-chip memory in a compact 484-BBGA package. It combines 92,000 logic elements with approximately 4.5 Mbits of embedded memory and 295 device I/Os to support dense, I/O‑heavy designs.

Designed for industrial-grade operation, the device supports a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C, making it suitable for deployments that require extended temperature capability and substantial logic and memory resources.

Key Features

  • Core Logic  92,000 logic elements provide the programmable fabric needed for complex combinational and sequential logic implementations.
  • Configurable Logic Blocks (CLBs)  11,500 CLBs enable structured logic partitioning for modular design and scalable resource utilization.
  • Embedded Memory  Approximately 4.5 Mbits of total on-chip RAM bits support data buffering, FIFOs, and local storage without immediate reliance on external memory.
  • I/O Density  295 device I/Os accommodate high pin-count interfacing, allowing integration with multiple peripherals and high-speed interfaces.
  • Power  Operates from a 1.14 V to 1.26 V supply range consistent with modern low-voltage FPGA core requirements.
  • Package and Mounting  484-BBGA (supplier package: 484-FPBGA, 23 × 23 mm) surface-mount package for compact board-level integration.
  • Industrial Temperature Range  Rated for -40 °C to 100 °C operation suitable for industrial environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Programmable logic and the industrial temperature rating support control, automation, and sensor interfacing applications that require robust operation across harsh temperature ranges.
  • High‑I/O Systems  With 295 I/Os and substantial on-chip memory, the device is suited for applications that need dense external connectivity and local buffering.
  • Data Aggregation and Protocol Bridging  Embedded memory and large logic resources enable on‑device data handling and protocol conversion tasks without immediate dependence on external processors.

Unique Advantages

  • High Logic Capacity: 92,000 logic elements provide headroom for complex designs and feature-rich implementations.
  • Substantial On‑Chip Memory: Approximately 4.5 Mbits of embedded RAM reduces the need for external memory for many buffering and storage tasks.
  • Large I/O Count: 295 device I/Os simplify board-level integration by supporting multiple interfaces and peripherals directly.
  • Industrial‑Grade Operation: Specified for -40 °C to 100 °C, supporting deployment in temperature-challenging environments.
  • Compact, High‑Density Package: 484-BBGA (23 × 23 mm) enables a compact PCB footprint while maintaining high pin count.
  • Regulatory Compliance: RoHS compliant for environmentally conscious product designs.

Why Choose LFE3-95EA-7LFN484I?

The LFE3-95EA-7LFN484I positions itself as a capable FPGA option for applications that require a combination of substantial programmable logic, on‑chip memory, and high I/O density within an industrial temperature envelope. Its specifications make it a practical choice for engineering teams building systems that must operate reliably from -40 °C to 100 °C while minimizing external component count.

Designed and manufactured by Lattice Semiconductor Corporation, this device suits designers seeking a balance of integration, predictable power requirements (1.14 V–1.26 V core supply), and a compact 484-BBGA footprint for space-constrained, high‑functionality products.

Request a quote or submit an inquiry to check availability and pricing for the LFE3-95EA-7LFN484I.

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