LFE3-95EA-7LFN484I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA |
|---|---|
| Quantity | 673 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11500 | Number of Logic Elements/Cells | 92000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-95EA-7LFN484I – ECP3 Field Programmable Gate Array, 92k Logic Elements, 295 I/Os, 484-BBGA
The LFE3-95EA-7LFN484I is an ECP3 FPGA IC from Lattice Semiconductor Corporation, offering a high count of programmable logic and on-chip memory in a compact 484-BBGA package. It combines 92,000 logic elements with approximately 4.5 Mbits of embedded memory and 295 device I/Os to support dense, I/O‑heavy designs.
Designed for industrial-grade operation, the device supports a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C, making it suitable for deployments that require extended temperature capability and substantial logic and memory resources.
Key Features
- Core Logic 92,000 logic elements provide the programmable fabric needed for complex combinational and sequential logic implementations.
- Configurable Logic Blocks (CLBs) 11,500 CLBs enable structured logic partitioning for modular design and scalable resource utilization.
- Embedded Memory Approximately 4.5 Mbits of total on-chip RAM bits support data buffering, FIFOs, and local storage without immediate reliance on external memory.
- I/O Density 295 device I/Os accommodate high pin-count interfacing, allowing integration with multiple peripherals and high-speed interfaces.
- Power Operates from a 1.14 V to 1.26 V supply range consistent with modern low-voltage FPGA core requirements.
- Package and Mounting 484-BBGA (supplier package: 484-FPBGA, 23 × 23 mm) surface-mount package for compact board-level integration.
- Industrial Temperature Range Rated for -40 °C to 100 °C operation suitable for industrial environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Programmable logic and the industrial temperature rating support control, automation, and sensor interfacing applications that require robust operation across harsh temperature ranges.
- High‑I/O Systems With 295 I/Os and substantial on-chip memory, the device is suited for applications that need dense external connectivity and local buffering.
- Data Aggregation and Protocol Bridging Embedded memory and large logic resources enable on‑device data handling and protocol conversion tasks without immediate dependence on external processors.
Unique Advantages
- High Logic Capacity: 92,000 logic elements provide headroom for complex designs and feature-rich implementations.
- Substantial On‑Chip Memory: Approximately 4.5 Mbits of embedded RAM reduces the need for external memory for many buffering and storage tasks.
- Large I/O Count: 295 device I/Os simplify board-level integration by supporting multiple interfaces and peripherals directly.
- Industrial‑Grade Operation: Specified for -40 °C to 100 °C, supporting deployment in temperature-challenging environments.
- Compact, High‑Density Package: 484-BBGA (23 × 23 mm) enables a compact PCB footprint while maintaining high pin count.
- Regulatory Compliance: RoHS compliant for environmentally conscious product designs.
Why Choose LFE3-95EA-7LFN484I?
The LFE3-95EA-7LFN484I positions itself as a capable FPGA option for applications that require a combination of substantial programmable logic, on‑chip memory, and high I/O density within an industrial temperature envelope. Its specifications make it a practical choice for engineering teams building systems that must operate reliably from -40 °C to 100 °C while minimizing external component count.
Designed and manufactured by Lattice Semiconductor Corporation, this device suits designers seeking a balance of integration, predictable power requirements (1.14 V–1.26 V core supply), and a compact 484-BBGA footprint for space-constrained, high‑functionality products.
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Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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