LFE3-95EA-8FN1156I

The LFE3-95EA-8FN1156I is an industrial-grade ECP3 family FPGA from Lattice Semiconductor Corporation. It delivers a high-density programmable fabric with 92,000 logic elements, extensive on-chip memory and broad I/O capability for compact, high-integration designs.

Designed for applications that require high I/O count, embedded memory and DSP-friendly resources, this device targets systems that need performance, flexibility and industrial temperature operation in a 1156-ball FPBGA package.

Key Features

• Core / Logic — 92,000 logic elements provide substantial programmable logic capacity for complex glue logic, protocol bridging and custom accelerators.
• Embedded Memory — Approximately 4.53 Mbits of on-chip RAM (total RAM bits: 4,526,080) to support buffers, FIFOs and embedded data structures without external memory.
• I/O Density — 490 user I/Os to support wide parallel interfaces, multiple peripheral connections and high pin-count designs.
• High‑Speed Serial and Protocol Support — Family-level embedded SERDES and protocol support as documented for ECP3 devices, enabling multi-gigabit serial channels and common networking/telecom protocols.
• sysDSP and DSP-Friendly Architecture — ECP3 family DSP resources (sysDSP) enable multiply-accumulate and high-performance signal processing building blocks appropriate for filtering, transforms and other arithmetic-heavy tasks.
• Configuration and System Support — ECP3 family configuration options include SPI boot flash interface and dual-boot image support for in-field flexibility (as specified for the family).
• Power — Core supply range specified at 1.14 V to 1.26 V for predictable power planning and regulator selection.
• Package and Mounting — 1156-FPBGA (35 × 35 mm) surface-mount package (1156-BBGA case) suitable for compact board layouts.
• Industrial Temperature — Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Compliance — RoHS compliant.

Typical Applications

• Networking and Telecom — Multi-gigabit serial support and high I/O count enable protocol bridging, packet processing and line-card interface functions.
• Video and Broadcast Processing — Large embedded RAM and DSP resources support frame buffering, real‑time processing and format conversion workflows.
• Industrial Control and Automation — Industrial temperature rating and abundant I/Os allow deployment in motor control, sensor aggregation and deterministic I/O applications.
• Data Acquisition and Instrumentation — High logic density and on-chip memory provide the building blocks for high-throughput data capture, preprocessing and interface conditioning.

Unique Advantages

• High Logic Density: 92,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level BOM and interconnect complexity.
• Substantial On-Chip Memory: Approximately 4.53 Mbits of embedded RAM minimizes reliance on external memory for many buffering and storage needs.
• Extensive I/O Resources: 490 user I/Os support broad parallel interfaces and multiple peripheral connections without additional bridge devices.
• Industrial Temperature Capability: −40 °C to 100 °C rating supports deployment in harsh or variable-temperature environments.
• Compact, High-Pin Package: 1156-FPBGA (35 × 35 mm) offers a balance of pin count and footprint for dense system designs.
• Predictable Power Envelope: Documented core supply range (1.14 V–1.26 V) simplifies power-supply design and validation.

Why Choose LFE3-95EA-8FN1156I?

The LFE3-95EA-8FN1156I positions itself as a high-density, industrial-grade FPGA option within the Lattice ECP3 family, combining sizable programmable logic resources with significant embedded memory and a high I/O count. It is well-suited for engineers and procurement teams building telecommunications, industrial automation, video processing or data-acquisition systems that require on-chip processing, buffering and flexible interfacing.

Choosing this device delivers a compact, surface-mount solution in a 1156-ball FPBGA package with defined electrical and thermal envelopes, enabling scalable designs that leverage the ECP3 family’s documented DSP, SERDES and configuration capabilities.

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