LFE3-95EA-8FN672I

The LFE3-95EA-8FN672I is an ECP3 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a high logic density fabric with substantial on-chip memory and a large I/O count in a compact ball-grid array package.

This device targets industrial-grade applications that require up to 92,000 logic elements, approximately 4.5 Mbits of embedded memory, and 380 I/O pins, while operating across a wide -40 °C to 100 °C temperature range.

Key Features

• Core Logic Up to 92,000 logic elements for implementing complex digital functions and custom logic.
• Embedded Memory Approximately 4.5 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density 380 I/O pins to support high-density peripheral interfacing and multi-channel connectivity.
• Power Supply Operates from a supply voltage range of 1.14 V to 1.26 V to match system power rails.
• Package 672-ball BGA (672-FPBGA, 27 × 27 mm) surface-mount package for compact, high-pin-count board designs.
• Temperature Range & Grade Industrial-grade device rated for operation from -40 °C to 100 °C to meet harsher environment requirements.
• Mounting & Compliance Surface-mount package and RoHS-compliant construction for modern PCB assembly and regulatory conformance.

Typical Applications

• Industrial Control Systems Use the device’s industrial temperature rating and large logic/memory resources to implement control, sequencing, and custom processing functions in industrial automation equipment.
• High-Density I/O Systems 380 I/O pins enable aggregation and interface of many sensors, actuators, or peripheral channels in compact designs.
• Communications and Infrastructure On-chip memory and extensive logic resources support protocol handling, data buffering, and custom packet processing in communications equipment.

Unique Advantages

• High Logic Capacity: 92,000 logic elements allow large-scale custom logic implementations without immediate migration to larger device classes.
• Substantial On-Chip Memory: Approximately 4.5 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage needs.
• Large I/O Count: 380 I/Os simplify board-level routing for multi-channel or multi-interface designs, lowering the need for external I/O expanders.
• Industrial Temperature Rating: Operation from -40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact High-Pin-Count Package: 672-ball BGA (27 × 27 mm) provides a balance of high connectivity within a space-efficient footprint.
• RoHS Compliant: Meets RoHS requirements for environmental compliance in manufacturing and end products.

Why Choose LFE3-95EA-8FN672I?

The LFE3-95EA-8FN672I positions itself as an industrial-grade FPGA option delivering large logic density, significant embedded memory, and extensive I/O in a compact 672-BBGA package. Its defined supply voltage range and wide operating temperature window align it with designs that demand reliable, high-capacity programmable logic in challenging operating conditions.

This device is suitable for designers who need to consolidate functions onto a single FPGA—reducing external components—while maintaining the capacity for complex logic, local buffering, and high channel counts in industrial and infrastructure applications.

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