LFE3-95EA-8LFN1156I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 490 4526080 92000 1156-BBGA |
|---|---|
| Quantity | 602 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA | Number of I/O | 490 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11500 | Number of Logic Elements/Cells | 92000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-95EA-8LFN1156I – ECP3 FPGA, 92,000 Logic Elements, 490 I/Os, 1156-BBGA
The LFE3-95EA-8LFN1156I is an industrial-grade Lattice ECP3 field programmable gate array (FPGA) in a 1156-BBGA package. It delivers a large programmable fabric with 92,000 logic elements, high I/O density and embedded memory, suitable for high-volume, high-speed, low-cost applications that require on-chip DSP, SERDES and flexible I/O.
Designed for system integration, this device combines a dense logic core, extensive I/O (490 pins) and on-chip memory to address communications, video, industrial and embedded system designs requiring robust temperature and supply operating ranges.
Key Features
- Logic Capacity — 92,000 logic elements to implement complex control, signal processing and protocol logic in a single device.
- Embedded Memory — Approximately 4.53 Mbits of on-chip RAM for frame buffers, FIFOs and local data storage.
- High I/O Count — 490 user I/Os provided in the 1156-BBGA package to support extensive peripheral interfacing and board-level routing.
- High-Speed SERDES and Protocol Support — Family-level embedded SERDES channels and multi-protocol support for high-speed serial interfaces including PCI Express, Ethernet, CPRI and SMPTE (as defined by the ECP3 family).
- sysDSP and Hardware Multipliers — Dedicated DSP resources and 18×18 multiplier blocks (as specified for the ECP3-95 family) for efficient multiply-accumulate and signal-processing tasks.
- Clocking Resources — Multiple PLLs and DLLs (family-level support) to manage complex clock domains and high-speed interface timing.
- Power and Supply — Core supply range specified at 1.14 V to 1.26 V for predictable power integration into designs.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial and demanding environments.
- Package and Mounting — 1156-FPBGA (35 × 35 mm) surface-mount package for high-density board designs.
- RoHS Compliant — Meets RoHS environmental requirements.
Typical Applications
- High-Speed Communications — Implement protocol bridging, packet processing and SERDES-based interfaces such as PCI Express, Ethernet and Serial RapidIO using on-chip SERDES and programmable logic.
- Broadcast and Video — Support SMPTE 3G and other video transport protocols with on-chip memory and DSP resources for buffering and real-time processing.
- Industrial Automation — Integrate control logic, motor and sensor interfacing, and deterministic I/O handling within an industrial-temperature FPGA.
- Embedded System Integration — Consolidate glue logic, accelerators and peripheral interfaces into a single FPGA for space- and cost-constrained designs.
Unique Advantages
- High Integration Density: 92,000 logic elements and substantial on-chip memory reduce external components and simplify board-level design.
- Multi-Protocol Serial Support: Embedded SERDES and family-level protocol support enable versatile connectivity options for networking and transport applications.
- DSP-Ready Architecture: Dedicated multipliers and sysDSP resources accelerate signal processing tasks while offloading the host CPU.
- Industrial Reliability: −40 °C to 100 °C operating range and surface-mount 1156-BBGA packaging support deployment in industrial environments.
- Controlled Power Integration: Defined core supply range (1.14 V to 1.26 V) helps simplify power-supply design and thermal planning.
- Regulatory and Environmental Compliance: RoHS compliance supports broader regional and environmental requirements.
Why Choose LFE3-95EA-8LFN1156I?
The LFE3-95EA-8LFN1156I offers a balanced combination of logic density, on-chip memory and high I/O count in a single industrial-grade FPGA package. Its capabilities for DSP acceleration, high-speed serial interfaces and flexible configuration make it well suited for communications, video, industrial and embedded applications that require integration and scalability.
Engineers selecting this device gain a solution that aligns performance, integration and environmental robustness, backed by the ECP3 family feature set for system-level timing, memory and serial connectivity.
Request a quote or submit an inquiry to begin procurement and get pricing, availability and lead-time information for the LFE3-95EA-8LFN1156I.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
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Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016