LFE3-95EA-8LFN1156I

IC FPGA 490 I/O 1156FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 490 4526080 92000 1156-BBGA

Quantity 602 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGANumber of I/O490Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11500Number of Logic Elements/Cells92000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-95EA-8LFN1156I – ECP3 FPGA, 92,000 Logic Elements, 490 I/Os, 1156-BBGA

The LFE3-95EA-8LFN1156I is an industrial-grade Lattice ECP3 field programmable gate array (FPGA) in a 1156-BBGA package. It delivers a large programmable fabric with 92,000 logic elements, high I/O density and embedded memory, suitable for high-volume, high-speed, low-cost applications that require on-chip DSP, SERDES and flexible I/O.

Designed for system integration, this device combines a dense logic core, extensive I/O (490 pins) and on-chip memory to address communications, video, industrial and embedded system designs requiring robust temperature and supply operating ranges.

Key Features

  • Logic Capacity — 92,000 logic elements to implement complex control, signal processing and protocol logic in a single device.
  • Embedded Memory — Approximately 4.53 Mbits of on-chip RAM for frame buffers, FIFOs and local data storage.
  • High I/O Count — 490 user I/Os provided in the 1156-BBGA package to support extensive peripheral interfacing and board-level routing.
  • High-Speed SERDES and Protocol Support — Family-level embedded SERDES channels and multi-protocol support for high-speed serial interfaces including PCI Express, Ethernet, CPRI and SMPTE (as defined by the ECP3 family).
  • sysDSP and Hardware Multipliers — Dedicated DSP resources and 18×18 multiplier blocks (as specified for the ECP3-95 family) for efficient multiply-accumulate and signal-processing tasks.
  • Clocking Resources — Multiple PLLs and DLLs (family-level support) to manage complex clock domains and high-speed interface timing.
  • Power and Supply — Core supply range specified at 1.14 V to 1.26 V for predictable power integration into designs.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial and demanding environments.
  • Package and Mounting — 1156-FPBGA (35 × 35 mm) surface-mount package for high-density board designs.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • High-Speed Communications — Implement protocol bridging, packet processing and SERDES-based interfaces such as PCI Express, Ethernet and Serial RapidIO using on-chip SERDES and programmable logic.
  • Broadcast and Video — Support SMPTE 3G and other video transport protocols with on-chip memory and DSP resources for buffering and real-time processing.
  • Industrial Automation — Integrate control logic, motor and sensor interfacing, and deterministic I/O handling within an industrial-temperature FPGA.
  • Embedded System Integration — Consolidate glue logic, accelerators and peripheral interfaces into a single FPGA for space- and cost-constrained designs.

Unique Advantages

  • High Integration Density: 92,000 logic elements and substantial on-chip memory reduce external components and simplify board-level design.
  • Multi-Protocol Serial Support: Embedded SERDES and family-level protocol support enable versatile connectivity options for networking and transport applications.
  • DSP-Ready Architecture: Dedicated multipliers and sysDSP resources accelerate signal processing tasks while offloading the host CPU.
  • Industrial Reliability: −40 °C to 100 °C operating range and surface-mount 1156-BBGA packaging support deployment in industrial environments.
  • Controlled Power Integration: Defined core supply range (1.14 V to 1.26 V) helps simplify power-supply design and thermal planning.
  • Regulatory and Environmental Compliance: RoHS compliance supports broader regional and environmental requirements.

Why Choose LFE3-95EA-8LFN1156I?

The LFE3-95EA-8LFN1156I offers a balanced combination of logic density, on-chip memory and high I/O count in a single industrial-grade FPGA package. Its capabilities for DSP acceleration, high-speed serial interfaces and flexible configuration make it well suited for communications, video, industrial and embedded applications that require integration and scalability.

Engineers selecting this device gain a solution that aligns performance, integration and environmental robustness, backed by the ECP3 family feature set for system-level timing, memory and serial connectivity.

Request a quote or submit an inquiry to begin procurement and get pricing, availability and lead-time information for the LFE3-95EA-8LFN1156I.

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