LFE3-95EA-8LFN484I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA |
|---|---|
| Quantity | 308 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11500 | Number of Logic Elements/Cells | 92000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-95EA-8LFN484I – ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA
The LFE3-95EA-8LFN484I is a Lattice Semiconductor ECP3 family FPGA delivering high logic density and a broad set of system interfaces for high‑speed, cost‑sensitive designs. It combines approximately 92,000 logic elements with a rich I/O complement and on‑chip memory to address communications, video, and DSP‑centric applications.
Built on the LatticeECP3 architecture, this device targets high‑performance, low‑cost applications with integrated SERDES, dedicated DSP resources, and flexible memory and I/O options for system integration and interface support.
Key Features
- Logic Capacity — Approximately 92,000 logic elements provide ample programmable resources for complex control, protocol handling, and custom logic implementation.
- On‑Chip Memory — Total RAM of 4,526,080 bits (approximately 4.53 Mbits) for embedded block RAM and distributed storage to support buffering, packet processing, and large state machines.
- DSP Resources (sysDSP) — Enhanced sysDSP architecture with abundant multiply/accumulate capability suitable for signal processing and arithmetic‑intensive tasks.
- High‑Speed SERDES and Interfaces — Embedded SERDES supporting multi‑Gbps channels and a wide range of serial protocols for high‑speed link implementations and protocol bridging.
- I/O Density and Standards — 295 user I/Os with programmable sysI/O buffer support for LVTTL/LVCMOS, LVDS and other standards, enabling versatile board‑level interfacing.
- Configuration and System Tools — Flexible configuration options including SPI boot and dual‑boot capability; supported by Lattice configuration and debug utilities noted for the ECP3 family.
- Power and Temperature — Core supply range of 1.14 V to 1.26 V and industrial operating temperature from -40 °C to 100 °C for deployment in demanding environments.
- Package and Assembly — Available in a 484‑FBPGA/484‑BBGA (23 × 23 mm) surface‑mount package with 295 I/Os, balancing density and board‑level routing.
- Compliance — RoHS‑compliant device suitable for modern electronics manufacturing requirements.
Typical Applications
- High‑Speed Communications — Implement protocol engines, aggregation, and line interfaces using embedded SERDES and extensive I/O for Ethernet, PCIe and other serial links.
- Video and Broadcast — Support SMPTE 3G and high‑bandwidth serial transport with on‑chip memory and DSP resources for real‑time processing and frame buffering.
- Signal Processing and DSP — Use sysDSP slices and abundant embedded RAM for filtering, accumulation, and other arithmetic‑intensive algorithms.
- Embedded System Integration — Combine control logic, memory interfaces and flexible I/O standards in a single FPGA to reduce board complexity and component count.
Unique Advantages
- Highly Integrated Logic and Memory: ~92,000 logic elements paired with approximately 4.53 Mbits of on‑chip RAM reduce external memory dependence and simplify system design.
- Flexible High‑Speed I/O: 295 configurable I/Os and embedded SERDES channels enable diverse protocol support and high throughput interconnects.
- Industrial Temperature Range: Rated from -40 °C to 100 °C for reliable operation in a wide range of industrial environments.
- Low‑Voltage Core: Core supply of 1.14–1.26 V supports contemporary board power architectures and helps optimize system power consumption.
- Board‑Ready Packaging: 484‑FBPGA/484‑BBGA (23 × 23 mm) surface‑mount package provides a balance of I/O count and PCB routing density.
- Manufacturer Toolchain Support: ECP3 family configuration and debug features streamline development, boot management and field updates.
Why Choose LFE3-95EA-8LFN484I?
The LFE3-95EA-8LFN484I positions itself as a versatile, industrial‑grade FPGA option within the Lattice ECP3 family—offering a strong mix of logic capacity, on‑chip memory, DSP capabilities, and high‑speed I/O in a compact 484‑BGA footprint. Its specification set makes it suitable for designs that require multi‑Gbps serial links, deterministic signal processing, and high I/O density while maintaining RoHS compliance.
Design teams seeking a scalable FPGA platform with embedded SERDES, significant embedded RAM, and a robust toolset for configuration and debugging will find this device well suited for communications, video, and embedded signal processing systems.
Request a quote or submit a pricing inquiry today to evaluate LFE3-95EA-8LFN484I for your next design.