LFE3-95EA-9FN1156I

The LFE3-95EA-9FN1156I is an ECP3 family field programmable gate array (FPGA) IC from Lattice Semiconductor, optimized for integrating high-density logic, embedded memory and extensive I/O in a compact FPGA fabric. It targets high-volume, high-speed and cost-sensitive applications that require substantial on-chip resources combined with industrial temperature operation.

This device delivers 92,000 logic elements, approximately 4.53 Mbits of total on-chip RAM and 490 user I/Os in a 1156-ball FBGA (35 × 35 mm) package, with a core supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic: 92,000 logic elements suitable for complex glue logic, protocol bridging and mid-density FPGA tasks.
• Embedded Memory: Approximately 4.53 Mbits of on-chip RAM for buffering, packet storage and local data processing.
• I/O Density: 490 user I/Os providing extensive external connectivity for parallel and serial interfaces.
• Package: 1156-BBGA (supplier package: 1156-FPBGA, 35 × 35 mm) enabling a high pin-count footprint in a single package.
• Power: Core voltage supply range 1.14 V to 1.26 V to match system power rails and optimize power delivery.
• Industrial Temperature Grade: Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• Family-Level Architecture: ECP3 family features such as embedded DSP resources, high-speed SERDES lanes and programmable I/O standards support system-level integration (family-level capabilities referenced from the ECP3 family data sheet).
• Standards and Tools: Device benefits from the ECP3 family ecosystem and configuration features described in the family data sheet (configuration options and development tools available at the vendor).
• RoHS Compliant: Device is RoHS compliant.

Typical Applications

• Communications and Networking: Use for protocol bridging, packet processing and high-density I/O aggregation where multi-gigabit SERDES and abundant logic are needed (family-level SERDES capability referenced in the data sheet).
• Broadcast and Video Transport: Suitable for video interface handling and transport applications that require deterministic timing and significant on-chip buffering.
• Industrial Control and Automation: Gate-level integration, sensor interfacing and real-time control in systems operating across extended temperature ranges.
• Storage and Peripheral Interfaces: Implement controller logic, bridging and custom peripheral interfaces that require dense I/O and embedded memory.

Unique Advantages

• High Logic Capacity: 92,000 logic elements enable integration of large logic blocks and complex state machines without external logic.
• Substantial On-Chip RAM: Approximately 4.53 Mbits of embedded RAM reduces external memory dependence and speeds local data handling.
• Extensive I/O Count: 490 I/Os facilitate dense board-level connectivity and support multiple parallel interfaces simultaneously.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in demanding environmental conditions.
• High-Pin-Count Packaging: 1156-ball FBGA (35 × 35 mm) provides the pin density required for complex multi-interface designs.
• RoHS Compliance: Meets environmental requirements for lead-free assembly.

Why Choose LFE3-95EA-9FN1156I?

The LFE3-95EA-9FN1156I combines sizable logic resources, multi-megabit embedded RAM and nearly 500 I/Os in a single industrial-temperature FPGA package, making it well suited for mid- to high-complexity designs that require integration, performance and board-level I/O density. It leverages the ECP3 family architecture to deliver DSP-friendly resources, configurable I/O standards and family-supported high-speed serial options (as documented in the ECP3 family data sheet).

This part is appropriate for designers building communication infrastructure, video transport systems, industrial controllers and other applications that demand robust operation across a wide temperature range and a compact, high-pin-count package. The device is supported by the ECP3 family documentation and vendor configuration utilities for design and deployment.

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