LFE3-95EA-9FN484I

The LFE3-95EA-9FN484I is an ECP3 family Field Programmable Gate Array (FPGA) in a 484-ball BGA package optimized for industrial applications. It combines a large logic fabric, substantial on-chip memory, and a high count of I/O pins to address complex embedded logic and interfacing requirements.

This device is suited for designs that require high-density programmable logic, significant embedded memory resources, and robust I/O connectivity while operating across an industrial temperature range.

Key Features

• Core Logic 92,000 logic elements provide a high-density programmable fabric for complex digital designs.
• Embedded Memory Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) for buffering, FIFOs, and microarchitectural storage.
• I/O Count 295 general-purpose I/O pins support extensive peripheral interfacing and board-level connectivity.
• Power Core supply range of 1.14 V to 1.26 V, enabling defined power budgeting and supply planning for the FPGA core.
• Package & Mounting Available in a 484-ball FPBGA supplier package (484-FPBGA, 23×23) / 484-BBGA package case and designed for surface-mount assembly.
• Temperature & Grade Industrial-grade device rated for operation from −40°C to 100°C for deployment in temperature-challenging environments.
• Standards Compliance RoHS-compliant construction supports environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control Use the industrial temperature rating, high logic capacity, and large I/O count for control systems, PLC interfaces, and factory automation tasks.
• High-Density Logic Integration Implement complex glue logic, custom state machines, and protocol bridging using the 92,000 logic elements and abundant embedded RAM.
• Data Routing and Buffering Leverage approximately 4.53 Mbits of on-chip RAM and many I/Os for packet buffering, data steering, and interface aggregation.
• Embedded System Prototyping Rapidly prototype and iterate embedded designs requiring a large programmable fabric and flexible I/O mapping.

Unique Advantages

• High Logic Density: 92,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Significant On-Chip Memory: Approximately 4.53 Mbits of embedded RAM supports data buffering and local storage without relying on external memories.
• Extensive I/O Capability: 295 I/O pins provide flexibility for connecting many peripherals, sensors, and high-pin-count interfaces.
• Industrial Reliability: Rated for −40°C to 100°C operation and supplied as an industrial-grade part for use in temperature-demanding installations.
• Board-Level Compatibility: Surface-mount 484-ball BGA (484-FPBGA, 23×23) packaging suits compact PCB layouts and modern assembly processes.
• Regulatory Compliance: RoHS-compliant device supports lead-free manufacturing requirements.

Why Choose LFE3-95EA-9FN484I?

The LFE3-95EA-9FN484I positions itself as a robust, high-capacity FPGA option for designs that need substantial programmable logic, embedded memory, and broad I/O in an industrial-grade package. Its combination of 92,000 logic elements, approximately 4.53 Mbits of on-chip RAM, and 295 I/Os makes it suitable for consolidating complex functions and reducing overall system BOM.

This FPGA is a practical choice for engineering teams building industrial controls, high-density interface bridges, and embedded prototypes that require predictable power, a defined operating temperature window, and compatibility with surface-mount BGA assembly.

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