LFE3-95EA-9FN672I

The LFE3-95EA-9FN672I is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor's ECP3 family supplied in a 672‑BBGA package. It delivers large programmable logic capacity and extensive I/O in a surface-mount, industrial-grade device.

With 92,000 logic elements, approximately 4.53 Mbits of embedded memory and 380 I/Os, this device targets designs that require high logic density, substantial on‑chip RAM and broad connectivity while operating from a 1.14 V to 1.26 V supply across an industrial temperature range.

Key Features

• Core Logic  92,000 logic elements provide high programmable logic capacity for complex custom digital functions.
• Embedded Memory  Approximately 4.53 Mbits of on‑chip RAM available for buffering, state machines and intermediate data storage.
• I/O Capacity  380 programmable I/Os support wide interfacing and connectivity to external devices and subsystems.
• Package & Mounting  672‑BBGA package (supplier device package: 672‑FPBGA, 27×27 mm) in a surface‑mount form factor for compact board integration.
• Power  Operates from a core supply range of 1.14 V to 1.26 V to match low‑voltage system domains.
• Temperature Range  Industrial operating temperature of −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS‑compliant construction for environmentally conscious designs.

Typical Applications

• Industrial Control  High logic capacity and industrial temperature rating make this FPGA suitable for control tasks, real‑time processing and custom logic in industrial equipment.
• I/O‑Rich Systems  With 380 I/Os, the device is well suited for applications that require extensive interfacing such as protocol bridging, sensor aggregation or multi‑lane connectivity.
• Embedded Systems  Large on‑chip RAM and programmable logic enable integration of custom accelerators, state machines and data buffering within compact embedded designs.

Unique Advantages

• High Logic Density: 92,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
• Significant On‑Chip Memory: Approximately 4.53 Mbits of embedded RAM supports local data storage and high-throughput buffering without external memory.
• Extensive I/O Count: 380 I/Os simplify integration with peripherals and external subsystems, lowering the need for additional interface chips.
• Industrial‑Grade Reliability: Rated for −40 °C to 100 °C operation and surface‑mount packaging for robust performance in industrial environments.
• Compact BGA Footprint: 672‑BBGA (27×27 mm) enables a high‑density implementation while maintaining a manageable PCB footprint.
• Low‑Voltage Core: Narrow core supply range (1.14 V–1.26 V) supports modern low‑voltage power architectures.

Why Choose LFE3-95EA-9FN672I?

The LFE3-95EA-9FN672I positions itself as a high‑capacity, industrial‑grade FPGA option for designs that require substantial programmable logic, on‑chip memory and a large I/O complement in a compact BGA package. Its combination of 92,000 logic elements, approximately 4.53 Mbits of embedded RAM and 380 I/Os provides a platform for consolidating complex functions and reducing system BOM.

This device is appropriate for engineers and teams building robust industrial and I/O‑intensive systems that need configurable hardware resources with defined voltage and temperature characteristics. Its RoHS compliance and standard surface‑mount BGA package support streamlined manufacturing and long‑term deployment.

Request a quote or submit an inquiry to receive pricing, lead time and availability for the LFE3-95EA-9FN672I.