LFE5U-12F-6BG256I
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 197 589824 12000 256-LFBGA |
|---|---|
| Quantity | 1,808 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 197 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3000 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 589824 |
Overview of LFE5U-12F-6BG256I – ECP5 Field Programmable Gate Array (FPGA), 12,000 logic elements, 256-LFBGA
The LFE5U-12F-6BG256I is an ECP5 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a programmable logic fabric based on the ECP5 architecture and is intended for designs that require significant on-chip logic, embedded memory, and a high count of user I/Os.
With 12,000 logic elements, approximately 0.59 Mbits of embedded RAM, and 197 I/Os in a compact 256-LFBGA package, this device is suited for industrial-grade applications where integration, I/O density, and predictable operating-range specifications are required.
Key Features
- Core Capacity 12,000 logic elements providing ample programmable logic resources for glue logic, control paths, and custom accelerators.
- Embedded Memory Approximately 589,824 bits of on-chip RAM for FIFOs, buffering, and small data storage needs without external memory.
- I/O Density 197 user I/O pins to support multiple interfaces and board-level protocol bridging in a single device.
- Package & Mounting 256-LFBGA (supplier device package: 256-CABGA, 14×14) in a surface-mount package suitable for compact PCB layouts.
- Power Core supply voltage specified from 1.045 V to 1.155 V for predictable power supply planning.
- Thermal & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
- Architecture & Family Features Built on the ECP5 family architecture which includes programmable I/O cells, clocking resources, sysDSP slices, DDR memory support, and SERDES/physical coding structures as detailed in the ECP5 family datasheet.
- Environmental Compliance RoHS compliant for environmental and regulatory alignment.
Typical Applications
- Programmable logic and glue Implement board-level glue logic and custom control functions using the device’s 12,000 logic elements and abundant I/O.
- I/O bridging and protocol adaptation Use the 197 I/Os to consolidate multiple interfaces and perform protocol translation on a single FPGA.
- On-chip buffering and state Leverage approximately 0.59 Mbits of embedded RAM for small buffering, FIFOs, and state storage without external memory.
- Industrial systems Deploy in industrial-temperature designs that require operation across −40 °C to 100 °C and RoHS compliance.
Unique Advantages
- Highly integrated logic and memory: 12,000 logic elements paired with embedded RAM reduce the need for discrete glue ICs and external memory for small buffers.
- High I/O count: 197 user I/Os enable flexible interfacing and consolidation of multiple board functions into a single device.
- Compact packaging: 256-LFBGA (14×14 supplier CABGA) provides a dense footprint for space-constrained PCBs.
- Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in demanding environments.
- Predictable core power: A defined core voltage range of 1.045 V to 1.155 V simplifies power supply design and sequencing.
- Family-level architecture: ECP5 family features such as programmable I/O cells, clocking, sysDSP slices, DDR memory support, and SERDES capability are available as part of the device architecture described in the ECP5 datasheet.
Why Choose LFE5U-12F-6BG256I?
The LFE5U-12F-6BG256I combines the ECP5 family architecture from Lattice Semiconductor with a balanced mix of logic, embedded memory, and high I/O count in a compact industrial-grade package. Its defined core supply range and wide operating temperature make it suitable for designs that require stable electrical characteristics and environmental robustness.
This device is a practical choice for engineers and procurement teams designing systems that need consolidated programmable logic, on-chip RAM for buffering, and extensive I/O routing in a single, RoHS-compliant FPGA package. Detailed architectural capabilities and implementation guidance are available in the ECP5 family datasheet.
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