LFE5U-12F-6BG381I

The LFE5U-12F-6BG381I is a member of the Lattice Semiconductor ECP5 FPGA family. It delivers a mid-range programmable fabric with 12,000 logic elements, substantial embedded memory, and a broad I/O count in a compact 381-ball FBGA package.

Designed for industrial applications and embedded systems, this device combines reconfigurable logic, on-chip memory and DSP resources, and SERDES/DDR capability described in the ECP5 family datasheet, enabling implementation of control, signal-processing and high-density I/O subsystems within a single device footprint.

Key Features

• Core Logic — 12,000 logic elements provide the programmable fabric capacity required for complex glue logic, protocol bridging, and mid-density FPGA functions.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM (589,824 bits) for buffering, FIFOs and local data storage.
• I/O Resources — 197 user I/O pins support a wide range of external interfaces and parallel/serial connectivity options.
• Package & Mounting — 381-FBGA package (supplier package: 381-CABGA, 17×17) in a surface-mount form factor for compact board integration.
• Power — Core voltage operating range 1.045 V to 1.155 V to match system power rails and power budgeting requirements.
• Operating Temperature & Grade — Industrial-grade device rated for −40 °C to 100 °C operation.
• Clocking and Timing — ECP5 family architecture includes PLLs, clock distribution and divider resources for flexible timing management as detailed in the datasheet.
• Memory and DSP Blocks — The ECP5 architecture provides sysMEM blocks and sysDSP slices for implemented memory configurations and DSP operations referenced in the family documentation.
• High-speed Interfaces — ECP5 family feature set includes SERDES and DDR memory support for high-speed link and memory interface options.
• Configuration & Reliability — Family datasheet references device configuration features, Single Event Upset (SEU) support options, an on-chip oscillator, and IEEE 1149.1-compliant boundary scan testability.
• Standards & Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Use the device for real-time control logic, sensor aggregation and protocol bridging where industrial temperature range and high I/O density are required.
• Communications and Networking — Implement SERDES-based links, DDR interfaces and packet-processing functions leveraging the ECP5 family high-speed interface features.
• Signal Processing and Imaging — Deploy on-chip sysDSP slices and embedded memory for intermediate signal processing, filtering and image pre-processing tasks.
• Embedded Systems and OEM Devices — Serve as a compact, reprogrammable logic hub in space-constrained, surface-mount designs using the 381-ball FBGA package.

Unique Advantages

• Compact, high-density package: 381-FBGA (381-CABGA, 17×17) enables significant logic and I/O capability in a small board area.
• Balanced logic and memory: 12,000 logic elements paired with approximately 0.59 Mbits of embedded RAM provide a versatile platform for mixed control and data-path designs.
• Industrial thermal rating: −40 °C to 100 °C operating range supports deployment in industrial environments.
• Flexible clocking and DSP building blocks: Family-level PLLs, clock distribution, sysDSP and sysMEM resources support varied timing and signal-processing requirements.
• High I/O count and interface support: 197 I/Os along with family-level SERDES and DDR support facilitate integration of multiple peripherals and high-speed links.
• Design and testability options: IEEE 1149.1 boundary scan and on-chip configuration features support production test and in-field configuration strategies.

Why Choose LFE5U-12F-6BG381I?

The LFE5U-12F-6BG381I combines a mid-range programmable fabric with significant I/O, embedded memory and family-level support for DSP, SERDES and DDR interfaces. Its industrial temperature rating and compact 381-FBGA package make it a pragmatic choice for embedded and industrial designs that require reconfigurable logic, local memory and high I/O density in a surface-mount form factor.

As part of the Lattice ECP5 family, this device is positioned for engineers needing a balance of integration, configurability and the architecture features documented for the series—providing a scalable option for control, connectivity and signal-processing subsystems.

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