LFE5U-12F-6BG381C

The LFE5U-12F-6BG381C is a Lattice Semiconductor ECP5 family field programmable gate array (FPGA) supplied in a 381‑FBGA package. This commercial‑grade device integrates approximately 12,000 logic elements, about 0.59 Mbits of embedded RAM, and 197 user I/O pins to address mid‑density programmable logic needs.

With a compact 381‑CABGA (17×17) package, surface‑mount mounting, and a recommended supply window of 1.045 V to 1.155 V, this FPGA is sized for designs where integration density, embedded memory, and a high I/O count are primary considerations.

Key Features

• Core logic Approximately 12,000 logic elements (12k) for implementing combinational and sequential logic.
• Embedded memory Approximately 0.59 Mbits of on‑chip RAM (589,824 bits) for buffering, FIFOs, and small data storage.
• I/O capacity 197 user I/O pins to support parallel interfaces, control signals, and diverse external connections.
• Package and mounting 381‑FBGA package case; supplier device package listed as 381‑CABGA (17×17). Surface mount device suitable for standard PCB assembly processes.
• Power Recommended core voltage range from 1.045 V to 1.155 V for device operation.
• Temperature range Commercial operating range: 0 °C to 85 °C.
• Compliance RoHS‑compliant for lead‑free manufacturing requirements.

Typical Applications

• Custom programmable logic Use the device to implement application‑specific logic, state machines, and glue logic where ~12k logic elements are required.
• I/O‑rich interfaces High pin count (197 I/Os) enables parallel interfaces, multi‑signal control planes, and mixed I/O systems.
• Embedded memory buffering On‑chip RAM (approximately 0.59 Mbits) supports data buffering, small lookup tables, and temporary storage without external memory.

Unique Advantages

• Balanced logic and memory combination: ~12k logic elements paired with ~0.59 Mbits of embedded RAM supports mid‑density designs without immediate need for external memory.
• High I/O density: 197 user I/Os provide flexibility for parallel buses, multiple peripherals, and complex control interfaces.
• Compact, industry‑standard package: 381‑CABGA (17×17) package offers a compact footprint for space‑constrained PCBs while maintaining ample I/O and routing resources.
• Predictable power window: Narrow recommended supply range (1.045 V–1.155 V) simplifies power design and voltage rail management.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match general commercial and industrial ambient conditions.
• RoHS compliance: Conforms to lead‑free manufacturing requirements for modern assembly processes.

Why Choose LFE5U-12F-6BG381C?

The LFE5U-12F-6BG381C positions itself as a mid‑density FPGA option within the ECP5 family, combining a useful balance of logic capacity, embedded memory, and a high I/O count in a compact 381‑FBGA package. Its defined power window and commercial temperature rating make it straightforward to integrate into systems where predictable electrical and thermal behavior is required.

This device is well suited to designers and procurement teams seeking a programmable logic device with approximately 12,000 logic elements, significant on‑chip RAM, and nearly 200 I/Os in a 17×17 package. Its RoHS compliance and surface‑mount form factor support standard manufacturing flows and lead‑free assembly processes.

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