LFE3-95EA-8LFN672I

The LFE3-95EA-8LFN672I is an ECP3 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, delivering high-density programmable logic in a compact ball-grid array package. With 92,000 logic elements, approximately 4.526 Mbits of embedded memory and 380 I/Os, this device targets industrial applications that require substantial logic capacity, significant on-chip RAM, and large I/O counts.

Designed for surface-mount assembly in a 672-ball BGA footprint and rated for industrial temperature operation, the device provides a combination of integration and environmental suitability for designs operating between -40 °C and 100 °C.

Key Features

• Core Logic  92,000 logic elements provide substantial capacity for implementing custom digital functions and complex datapaths.
• Embedded Memory  Approximately 4.526 Mbits of on-chip RAM for buffering, state storage, and intermediate data processing without requiring large external memory.
• I/O Density  380 I/Os support designs that require numerous external interfaces, sensors, or peripherals.
• Power  Low-voltage operation with a supply range of 1.14 V to 1.26 V to meet power-constrained design requirements.
• Package & Mounting  672-BBGA package (supplier device package: 672-FPBGA, 27 × 27 mm) for high-density board integration; surface-mount mounting type.
• Temperature Range  Industrial operating range from -40 °C to 100 °C for deployment in a wide range of ambient conditions.
• Environmental Compliance  RoHS-compliant to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control and Automation  Reconfigurable logic and extensive I/O counts allow implementation of control logic, signal aggregation and custom interfaces within industrial temperature requirements.
• Embedded Systems and Prototyping  Substantial logic capacity and on-chip RAM enable integration of complex algorithms and rapid iteration during development.
• High-Density I/O Designs  Compact 672-BBGA packaging combined with 380 I/Os suits designs that require many external connections in a small board area.
• Data Handling and Interfacing  Large embedded memory and logic resources support on-chip data buffering and custom interface logic without immediate reliance on external memory.

Unique Advantages

• High logic capacity: 92,000 logic elements provide room for complex functions and multi-module integration on a single device, reducing component count.
• Significant on-chip memory: Approximately 4.526 Mbits of embedded RAM helps minimize external memory dependencies and simplifies board-level design.
• Extensive I/O availability: 380 I/Os reduce the need for external multiplexers or expanders in I/O-heavy designs.
• Industrial temperature rating: Rated from -40 °C to 100 °C for reliable operation in industrial environments.
• Compact BGA package: 672-BBGA (672-FPBGA, 27 × 27 mm) balances high integration density with board-space efficiency.
• RoHS compliance: Meets common environmental and manufacturing requirements.

Why Choose LFE3-95EA-8LFN672I?

The LFE3-95EA-8LFN672I positions itself as a high-density, industrial-grade FPGA option for designs that demand substantial logic resources, significant on-chip memory, and broad I/O capability in a compact BGA package. Its low-voltage operation and RoHS compliance make it suitable for modern, environmentally conscious product development.

This device is well suited for engineers and teams developing industrial control systems, embedded platforms, and I/O-intensive applications that require scalable logic capacity and dependable thermal performance.

If you would like pricing or availability for the LFE3-95EA-8LFN672I, request a quote or submit a pricing inquiry to receive further information.