LFE3-95EA-9FN1156C

The LFE3-95EA-9FN1156C is a commercial-grade Field Programmable Gate Array (FPGA) from the Lattice ECP3 family. It delivers high logic density with 92,000 logic elements and extensive on-chip memory and I/O, enabling compact, integrated implementations for communications, video, and embedded applications.

Built for system integration, this surface-mount device ships in a 1156-ball FPBGA (35 × 35 mm) package, provides approximately 4.53 Mbits of embedded memory, and supports a 1.14 V to 1.26 V core supply with an operating temperature range of 0 °C to 85 °C.

Key Features

• Programmable Logic 92,000 logic elements provide significant fabric capacity for complex logic, control and data-path implementation.
• On-chip Memory Approximately 4.53 Mbits of embedded RAM for buffering, packet storage, and state machines.
• High I/O Count 490 user I/Os accommodate wide parallel interfaces, multiple high-speed lanes, and dense peripheral connections.
• Family-level High-speed SERDES The ECP3 family includes embedded SERDES capable of data rates up to 3.2 Gbps and support for common serial protocols.
• Enhanced DSP and Timing Resources Family features include sysDSP slices, hardware multipliers, PLLs and DLLs for timing and signal-processing tasks.
• Flexible Configuration Family features include SPI boot flash interfaces, dual-boot image support and in-field reconfiguration options.
• Package and Mounting Surface-mount 1156-FPBGA package (35 × 35 mm) for board-level integration in space-constrained designs.
• Commercial Temperature and Power Specified for 0 °C to 85 °C operation and a core voltage range of 1.14 V to 1.26 V.
• RoHS Compliant Conforms to RoHS environmental requirements for lead-free assembly.

Typical Applications

• Network and Telecom Equipment — Implements protocol bridging, packet processing and interface aggregation using the device’s high logic density and SERDES capabilities.
• Video and Broadcast Systems — Supports high-speed serial interfaces and DSP resources for video transport and formatting tasks.
• Data Acquisition and Signal Processing — Uses on-chip memory and sysDSP resources to implement real-time filtering, aggregation and preprocessing.
• Embedded Systems and Prototyping — Provides broad I/O and reprogrammability for system control, custom peripherals and rapid hardware iteration.

Unique Advantages

• High Logic Capacity: 92,000 logic elements enable mid- to high-complexity designs without immediate need to move to larger devices.
• Substantial On-Chip Memory: Approximately 4.53 Mbits of embedded RAM reduces external memory dependencies and simplifies board design.
• Large I/O Surface: 490 I/Os in a 1156-ball package support multiple parallel buses and lane configurations, reducing external bridge components.
• Family Feature Set: Access to ECP3 family capabilities such as high-speed SERDES, sysDSP slices, PLLs/DLLs and flexible configuration options streamlines system-level design.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match a wide range of commercial electronic products and systems.
• RoHS Compliance: Supports lead-free manufacturing and regulatory requirements for many global markets.

Why Choose LFE3-95EA-9FN1156C?

The LFE3-95EA-9FN1156C is positioned for designers who need a highly integrated, mid-to-high density FPGA with broad I/O and substantial on-chip memory in a compact BGA package. Its ECP3 family feature set—covering SERDES, DSP resources and flexible configuration—helps reduce external components and accelerates time-to-market for communications, video and embedded applications.

For teams focused on scalable designs and reliable vendor tool support, this device offers a balance of logic capacity, memory, and I/O in a commercial-grade FPGA suitable for production systems and advanced prototypes.

If you need pricing, availability, or to request a quote for the LFE3-95EA-9FN1156C, submit a sales inquiry with your quantity and delivery requirements to receive a formal quote and lead-time information.