LFE3-95EA-8LFN672C

The LFE3-95EA-8LFN672C is a commercial-grade ECP3 family FPGA in a 672-ball BGA (27 × 27 mm) package designed for system integration where mid-to-high logic density and flexible I/O are required. This device combines approximately 92,000 logic elements, roughly 4.5 Mbits of embedded RAM, and 380 user I/Os to address applications needing programmable logic, on-chip memory, and high-speed serial interfaces.

Built on the Lattice ECP3 architecture, the device targets communications, industrial control, and embedded processing applications that benefit from a balance of performance, low-voltage operation (1.14 V–1.26 V), and surface-mount packaging for compact board designs.

Key Features

• Logic Capacity Approximately 92,000 logic elements provide substantial LUT-based logic resources for complex custom logic and glue-logic functions.
• Memory Approximately 4.5 Mbits of on-chip embedded memory (EBR) to support data buffering, packet storage, and intermediate processing without external RAM.
• I/O Density 380 user I/Os in the 672-BBGA package enable wide parallel interfaces, mixed-signal front-end connectivity, and multi-channel system integration.
• High-Speed SERDES and Interfaces (Family Capability) ECP3 family programmable SERDES supporting data rates up to 3.2 Gbps and multi-channel serial links in the 672-pin package, enabling common serial protocols and board-level high-speed links.
• DSP and Arithmetic Acceleration (Family Capability) sysDSP slice architecture provides hardware multiply-accumulate resources and flexible slice configurations for signal processing and algorithm acceleration.
• Clocking and PLLs (Family Capability) Multiple PLLs and DLLs on-chip provide clock management and frequency synthesis for synchronous system designs.
• Power and Supply Core voltage support from 1.14 V to 1.26 V for the FPGA core; standard surface-mount package simplifies PCB assembly.
• Package and Mounting 672-ball FPBGA (27 × 27 mm) surface-mount package suitable for dense, high-I/O board layouts.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operation for mainstream commercial applications.
• RoHS Compliant Meets environmental lead-free requirements for regulated markets.

Typical Applications

• Communications and Networking Implements protocol bridging, packet buffering, and multi-gigabit serial links using the device's SERDES capabilities and on-chip RAM.
• Industrial Control Enables real-time control, sensor aggregation, and interface translation with abundant logic elements and high I/O count.
• Embedded Signal Processing Offloads DSP tasks and filtering functions to the device’s sysDSP architecture and embedded memory for low-latency processing.
• Prototyping and System Integration Acts as a highly configurable glue-logic and integration hub for complex boards requiring many I/Os and programmable logic.

Unique Advantages

• High Logic and Memory Density: Approximately 92,000 logic elements combined with ~4.5 Mbits of embedded RAM reduce the need for external logic and memory components.
• Flexible I/O Count: 380 user I/Os in a 672-ball BGA allow broad signal interfacing and support for wide parallel buses or many peripheral connections.
• Low-Voltage Core Operation: Narrow core supply range (1.14 V–1.26 V) supports consistent power budgeting in tightly constrained designs.
• System-Level Integration: Family features such as multi-channel SERDES, sysDSP slices, and PLL/DLL resources enable integrating communications, timing, and signal processing into a single device.
• Commercial-Grade Reliability: Designed for 0 °C to 85 °C operation and RoHS compliance for mainstream, environmentally regulated deployments.

Why Choose LFE3-95EA-8LFN672C?

The LFE3-95EA-8LFN672C is positioned for engineers who need a balanced FPGA solution with substantial logic, embedded memory, and a high I/O count in a compact surface-mount package. Its ECP3 family architecture delivers programmable DSP resources, clock management, and high-speed serial interface capability suitable for a wide range of communications, industrial, and embedded applications.

Choosing this device provides scalability within the ECP3 family and access to the family-level features summarized in the datasheet, making it a practical option for designs that require on-chip memory, flexible I/O, and integrated serial/interface resources while maintaining commercial-grade operating specifications.

Request a quote or submit an inquiry to receive pricing and availability information for the LFE3-95EA-8LFN672C.