LFE3-95EA-8LFN1156C

IC FPGA 490 I/O 1156FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 490 4526080 92000 1156-BBGA

Quantity 1,364 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1156-BBGANumber of I/O490Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11500Number of Logic Elements/Cells92000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-95EA-8LFN1156C – ECP3 FPGA, approximately 92,000 logic elements, 1156-BBGA

The LFE3-95EA-8LFN1156C is an ECP3 family field-programmable gate array (FPGA) from Lattice Semiconductor Corporation, provided in a 1156-ball BGA package. It delivers a balance of programmable logic, embedded memory and I/O capacity for commercial embedded designs.

With approximately 92,000 logic elements, about 4.53 Mbits of on-chip RAM, 490 I/Os and low-voltage operation, this device targets applications requiring dense logic integration, significant on-chip storage and a compact surface-mount package while operating within standard commercial temperature and supply ranges.

Key Features

  • Core Logic  Approximately 92,000 logic elements and 11,500 CLBs provide substantial programmable logic capacity for complex designs.
  • Embedded Memory  Approximately 4.53 Mbits of on-chip RAM to support buffering, state storage and local data processing.
  • I/O Density  490 I/O pins allow flexible interfacing to peripherals, sensors and external devices in compact systems.
  • Power  Operates from a core supply range of 1.14 V to 1.26 V, supporting low-voltage FPGA system designs.
  • Package & Mounting  Supplied in a 1156-BBGA (supplier package: 1156-FPBGA, 35 × 35 mm) surface-mount package for high-density PCB implementations.
  • Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
  • Standards Compliance  RoHS compliant to support regulatory requirements for lead-free assembly.

Unique Advantages

  • High logic capacity: Approximately 92,000 logic elements enable consolidation of multiple functions onto a single device, reducing system complexity.
  • Significant on-chip memory: Around 4.53 Mbits of embedded RAM minimizes external memory needs for many designs, simplifying board layout.
  • Extensive I/O resources: 490 I/Os provide flexibility for dense peripheral interfacing without requiring additional interface chips.
  • Compact ball-grid package: 1156-FPBGA (35×35 mm) packaging supports high-density PCB designs while maintaining a surface-mount form factor.
  • Low-voltage core operation: 1.14 V–1.26 V supply range supports lower-power core designs where applicable.
  • Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial deployments.

Why Choose LFE3-95EA-8LFN1156C?

The LFE3-95EA-8LFN1156C combines a large logic fabric, substantial embedded memory and a high I/O count in a compact 1156-BBGA surface-mount package. Its specification set supports integration of complex programmable functions while keeping board real estate and external component count under control.

As a commercial-grade FPGA from Lattice Semiconductor Corporation with RoHS compliance and well-defined supply and temperature ranges, this part is suited to designers seeking a robust, scalable programmable-logic building block for embedded and digital-system projects where dense logic, on-chip memory and I/O capacity are key considerations.

Request a quote or submit an inquiry to receive pricing and availability information for LFE3-95EA-8LFN1156C.

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