LFE3-95EA-8FN484C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA |
|---|---|
| Quantity | 1,274 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11500 | Number of Logic Elements/Cells | 92000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-95EA-8FN484C – ECP3 Field Programmable Gate Array (92,000 logic elements, approximately 4.53 Mbits RAM, 295 I/Os)
The LFE3-95EA-8FN484C is a member of the LatticeECP3 family of SRAM-based FPGAs, delivering a balance of high logic capacity, embedded memory and flexible I/O in a surface-mount 484-BBGA package. Designed for systems that require DSP capability, high-speed serial links and broad I/O support, this commercial-grade device targets cost-sensitive, performance-oriented applications.
With 92,000 logic elements and approximately 4.53 Mbits of on-chip RAM, the device provides integration for signal processing, protocol bridging and interface consolidation while operating from a 1.14 V to 1.26 V core supply and a commercial temperature range of 0 °C to 85 °C.
Key Features
- Core Capacity 92,000 logic elements for complex logic integration and system consolidation.
- Embedded Memory Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) plus distributed RAM resources to support buffering, packet processing and algorithm state storage.
- High I/O Count 295 user I/Os provided in the 484-BBGA package to support dense peripheral, memory and interface connectivity.
- Embedded SERDES Family-level SERDES support with data rates from 150 Mbps to 3.2 Gbps for common serial protocols and multi‑channel link implementations.
- sysDSP and Arithmetic Enhanced DSP slice architecture in the ECP3 family for multiply-accumulate and high-performance arithmetic operations.
- Clocking Device-level support for up to ten PLLs and two DLLs (family specification) to manage multi-domain clocking and high-speed interface timing.
- Flexible sysI/O Programmable I/O buffer options and source-synchronous I/O features that support a wide range of voltage standards and memory interfaces (family-level capabilities).
- Package & Power 484-BBGA (supplier package 484-FPBGA, 23 × 23 mm) surface-mount package; core supply specified at 1.14 V to 1.26 V.
- Commercial Grade & Environmental Commercial temperature rating (0 °C to 85 °C) and RoHS-compliant construction.
Typical Applications
- High-speed communications Implement protocol bridging and line cards that require SERDES-based links and flexible packet processing.
- Video and broadcast interfaces Support SMPTE and other high-bandwidth serial interfaces using the device’s embedded SERDES and large memory resources.
- Embedded signal processing Deploy sysDSP features and on-chip RAM for real-time filtering, transforms and MAC-intensive algorithms.
- Memory interfacing and controllers Use the programmable sysI/O and dedicated source-synchronous features for DDR memory interfaces and data buffering.
Unique Advantages
- High integration density: 92,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board-level complexity.
- Substantial on-chip memory: Approximately 4.53 Mbits of embedded RAM supports packet buffering, FIFOs and algorithm state without immediate external memory dependence.
- Rich I/O and packaging: 295 user I/Os in a 484-BBGA (23 × 23 mm) footprint provide extensive connectivity for peripherals, sensors and memory buses.
- Flexible serial connectivity: Family-level SERDES with broad data-rate support provides options for implementing Ethernet, PCIe, SONET/SDH and other serial links.
- Clock and DSP resources: Multiple PLLs/DLLs and enhanced DSP slices (family features) simplify multi-domain timing and accelerate arithmetic workloads.
- Commercial readiness: Commercial temperature rating and RoHS compliance for standard production environments and regulatory alignment.
Why Choose LFE3-95EA-8FN484C?
The LFE3-95EA-8FN484C combines a large logic fabric, significant embedded memory and broad I/O in a compact 484-BBGA package to deliver a balanced platform for system designers. It is well suited to applications that require DSP acceleration, multiple high-speed serial interfaces and extensive peripheral connectivity while staying within commercial thermal and supply constraints.
As part of the LatticeECP3 family, the device benefits from family-level features such as flexible sysI/O, embedded SERDES and clocking resources, offering a scalable foundation for mid-range FPGA designs that demand integration, timing flexibility and on-chip data storage.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for LFE3-95EA-8FN484C. Our team can provide detailed ordering and volume pricing support to help integrate this device into your design cycle.