LFE3-95EA-8FN484C

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA

Quantity 1,274 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11500Number of Logic Elements/Cells92000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-95EA-8FN484C – ECP3 Field Programmable Gate Array (92,000 logic elements, approximately 4.53 Mbits RAM, 295 I/Os)

The LFE3-95EA-8FN484C is a member of the LatticeECP3 family of SRAM-based FPGAs, delivering a balance of high logic capacity, embedded memory and flexible I/O in a surface-mount 484-BBGA package. Designed for systems that require DSP capability, high-speed serial links and broad I/O support, this commercial-grade device targets cost-sensitive, performance-oriented applications.

With 92,000 logic elements and approximately 4.53 Mbits of on-chip RAM, the device provides integration for signal processing, protocol bridging and interface consolidation while operating from a 1.14 V to 1.26 V core supply and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Core Capacity  92,000 logic elements for complex logic integration and system consolidation.
  • Embedded Memory  Approximately 4.53 Mbits of on-chip RAM (4,526,080 bits) plus distributed RAM resources to support buffering, packet processing and algorithm state storage.
  • High I/O Count  295 user I/Os provided in the 484-BBGA package to support dense peripheral, memory and interface connectivity.
  • Embedded SERDES  Family-level SERDES support with data rates from 150 Mbps to 3.2 Gbps for common serial protocols and multi‑channel link implementations.
  • sysDSP and Arithmetic  Enhanced DSP slice architecture in the ECP3 family for multiply-accumulate and high-performance arithmetic operations.
  • Clocking  Device-level support for up to ten PLLs and two DLLs (family specification) to manage multi-domain clocking and high-speed interface timing.
  • Flexible sysI/O  Programmable I/O buffer options and source-synchronous I/O features that support a wide range of voltage standards and memory interfaces (family-level capabilities).
  • Package & Power  484-BBGA (supplier package 484-FPBGA, 23 × 23 mm) surface-mount package; core supply specified at 1.14 V to 1.26 V.
  • Commercial Grade & Environmental  Commercial temperature rating (0 °C to 85 °C) and RoHS-compliant construction.

Typical Applications

  • High-speed communications  Implement protocol bridging and line cards that require SERDES-based links and flexible packet processing.
  • Video and broadcast interfaces  Support SMPTE and other high-bandwidth serial interfaces using the device’s embedded SERDES and large memory resources.
  • Embedded signal processing  Deploy sysDSP features and on-chip RAM for real-time filtering, transforms and MAC-intensive algorithms.
  • Memory interfacing and controllers  Use the programmable sysI/O and dedicated source-synchronous features for DDR memory interfaces and data buffering.

Unique Advantages

  • High integration density: 92,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board-level complexity.
  • Substantial on-chip memory: Approximately 4.53 Mbits of embedded RAM supports packet buffering, FIFOs and algorithm state without immediate external memory dependence.
  • Rich I/O and packaging: 295 user I/Os in a 484-BBGA (23 × 23 mm) footprint provide extensive connectivity for peripherals, sensors and memory buses.
  • Flexible serial connectivity: Family-level SERDES with broad data-rate support provides options for implementing Ethernet, PCIe, SONET/SDH and other serial links.
  • Clock and DSP resources: Multiple PLLs/DLLs and enhanced DSP slices (family features) simplify multi-domain timing and accelerate arithmetic workloads.
  • Commercial readiness: Commercial temperature rating and RoHS compliance for standard production environments and regulatory alignment.

Why Choose LFE3-95EA-8FN484C?

The LFE3-95EA-8FN484C combines a large logic fabric, significant embedded memory and broad I/O in a compact 484-BBGA package to deliver a balanced platform for system designers. It is well suited to applications that require DSP acceleration, multiple high-speed serial interfaces and extensive peripheral connectivity while staying within commercial thermal and supply constraints.

As part of the LatticeECP3 family, the device benefits from family-level features such as flexible sysI/O, embedded SERDES and clocking resources, offering a scalable foundation for mid-range FPGA designs that demand integration, timing flexibility and on-chip data storage.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for LFE3-95EA-8FN484C. Our team can provide detailed ordering and volume pricing support to help integrate this device into your design cycle.

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