LFE3-95EA-7LFN672I

The LFE3-95EA-7LFN672I is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. This device provides 92,000 logic elements, approximately 4.526 Mbits of on-chip RAM (4,526,080 bits), and 380 I/Os in a surface-mount BGA package.

Packaged as a 672‑ball FPBGA (672‑BBGA, 27×27), the device operates from a 1.14 V to 1.26 V supply and is specified for industrial-grade operation from −40 °C to 100 °C, making it suitable for designs that require high logic density, substantial embedded memory, and extensive I/O in a compact form factor.

Key Features

• Core Logic  92,000 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 4.526 Mbits of on-chip RAM (4,526,080 bits) for buffering, state storage, and data processing.
• I/O Resources  380 general-purpose I/Os to support a wide range of peripheral and parallel interface requirements.
• Power  Nominal voltage supply range of 1.14 V to 1.26 V for core operation.
• Package & Mounting  672‑FBPGA (27×27) / 672‑BBGA surface-mount package enabling dense PCB integration.
• Temperature & Grade  Industrial grade device rated for operation from −40 °C to 100 °C.

Typical Applications

• Industrial Control  Industrial-grade temperature rating and extensive I/O make the device appropriate for control systems and embedded industrial logic functions that require reliable operation across a wide temperature range.
• High-density Logic Systems  Large logic element count and significant on-chip RAM support designs that need substantial programmable logic and memory integration.
• Multi-interface Embedded Systems  High I/O availability enables bridging and interfacing between multiple peripherals and parallel subsystems in embedded applications.

Unique Advantages

• High Logic Capacity: 92,000 logic elements offer the headroom to implement complex custom logic without external glue logic.
• Substantial Embedded Memory: Approximately 4.526 Mbits of on-chip RAM reduces the need for external memory for many buffering and stateful tasks.
• Extensive I/O: 380 I/Os provide flexibility to connect numerous peripherals, sensors, and interfaces directly to the FPGA fabric.
• Industrial Temperature Rating: Specified for −40 °C to 100 °C to support deployment in temperature-challenging environments.
• Compact BGA Packaging: 672‑ball FPBGA (27×27) surface-mount package enables high I/O density in a compact board footprint.

Why Choose LFE3-95EA-7LFN672I?

The LFE3-95EA-7LFN672I balances high logic density, substantial on-chip memory, and a large I/O complement in a compact 672‑ball BGA package. Its industrial temperature rating and surface-mount form factor make it a practical choice for embedded and industrial designs that demand reliability and dense integration.

Design teams seeking a programmable logic device with a strong combination of logic resources, embedded RAM, and broad I/O capability will find this FPGA aligns with requirements for scalable, robust implementations while maintaining a compact PCB footprint.

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