LFE3-95EA-7LFN1156I

The LFE3-95EA-7LFN1156I is a Lattice Semiconductor ECP3 family field-programmable gate array (FPGA) in a 1156-ball BGA package. This industrial-grade, surface-mount device combines high logic capacity, large on-chip RAM, and a high I/O count for applications that require significant integration and flexible interfacing.

Designed for system integration and embedded processing tasks, the device targets designs that need approximately 92,000 logic elements, around 4.53 Mbits of embedded memory, and up to 490 user I/Os while operating across a wide industrial temperature range.

Key Features

• Core Capacity — Approximately 92,000 logic elements for dense logic integration and complex FPGA designs.
• Embedded Memory — Approximately 4.53 Mbits of on-chip RAM to support buffering, state machines, and embedded data structures.
• I/O Density & Package — 490 user I/Os in a 1156-ball BGA package (supplier device package: 1156-FPBGA, 35×35 mm), surface mount for compact board mounting.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C for demanding environments.
• Power — Core supply operating range of 1.14 V to 1.26 V, compatible with 1.2 V-class core power domains.
• Family-Level Capabilities (ECP3) — ECP3 family features include embedded SERDES, enhanced sysDSP slices, multiple PLLs/DLLs, flexible sysI/O buffer support, and advanced configuration options such as SPI boot and dual-boot images, as described in the device family documentation.
• Configuration & Tooling Support — Family documentation references on-chip configuration features and system support facilities, including configuration interfaces and embedded utilities for development and debugging.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Industrial Control — High logic and I/O count enable complex motor control, PLC interfacing, and real-time signal aggregation in industrial systems.
• Communications & Networking — Large on-chip memory and abundant I/O make the device suitable for packet processing, protocol bridging, and interface aggregation.
• Video and Imaging — Ample logic resources and embedded RAM support preprocessing, buffering, and custom image pipelines.
• Instrumentation & Test — Industrial temperature rating and high I/O count suit high-channel-count data acquisition and test instrumentation applications.

Unique Advantages

• High integration density: Approximately 92,000 logic elements and multi-megabit embedded memory reduce external logic and memory needs, simplifying BOM and board area.
• Large I/O surface: 490 user I/Os in a compact 1156-ball package enable extensive peripheral and bus connectivity without external multiplexing.
• Industrial robustness: Rated for -40 °C to 100 °C operation to meet demanding environmental conditions in industrial deployments.
• Flexible configuration: ECP3 family configuration features such as SPI boot and dual-boot support streamline field updates and secure boot strategies.
• Surface-mount package: 1156-FPBGA (35×35 mm) mounting supports automated assembly and dense PCB layouts.
• Environmentally compliant: RoHS compliance supports regulatory requirements for modern electronic products.

Why Choose LFE3-95EA-7LFN1156I?

This ECP3 FPGA variant delivers a balance of high logic capacity, substantial embedded memory, and very high I/O count in an industrial-grade, surface-mount BGA package. It is well suited for designers who need to consolidate functionality, minimize external components, and support robust operation across a wide temperature range.

The device leverages ECP3 family architecture and configuration features to provide design flexibility and system-level capabilities that help shorten development cycles and reduce system complexity for mid-to-high density FPGA applications.

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