LFE3-95EA-7FN484I
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA |
|---|---|
| Quantity | 756 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11500 | Number of Logic Elements/Cells | 92000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-95EA-7FN484I – ECP3 FPGA, 92k logic elements, ~4.526 Mbits RAM, 295 I/Os, 484-BBGA
The LFE3-95EA-7FN484I is an industrial-grade ECP3 Field Programmable Gate Array (FPGA) IC supplied in a 484-BBGA package. It combines a high count of logic elements and substantial on-chip RAM with a broad I/O set to support complex, high-density embedded designs.
Its specified voltage supply range and wide operating temperature make it suited for industrial environments where robust performance and reliable interfacing are required.
Key Features
- Core Logic 92,000 logic elements provide programmable fabric for implementing complex custom logic, state machines, and data processing pipelines.
- Embedded Memory Approximately 4.526 Mbits of on-chip RAM supports buffering, FIFOs, and local data storage for high-throughput designs.
- I/O Density 295 user I/Os enable broad connectivity for parallel interfaces, buses, and multiple high-pin-count peripherals.
- Power Supported supply voltage range of 1.14 V to 1.26 V aligns with modern low-voltage FPGA core requirements.
- Package & Mounting 484-BBGA (supplier package: 484-FPBGA, 23×23) in a surface-mount format for compact board integration and high pin density.
- Temperature & Grade Industrial-grade device specified for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
- Environmental Compliance RoHS compliant, supporting regulatory requirements for hazardous substance restrictions.
Typical Applications
- Industrial Control & Automation — Implement deterministic control logic, sensor interfacing, and I/O aggregation using extensive logic resources and 295 I/Os.
- High-Density I/O Bridging — Serve as a protocol bridge or interface concentrator where large pin counts and embedded RAM are required for buffering.
- Communications & Networking — Use the FPGA fabric and on-chip memory for packet processing, parallel data paths, and custom protocol handling in industrial networking equipment.
Unique Advantages
- High Logic Capacity: 92,000 logic elements enable implementation of sizable custom logic blocks and parallel datapaths, reducing the need for multiple discrete devices.
- Substantial Embedded Memory: Approximately 4.526 Mbits of on-chip RAM provides local storage for buffers and FIFOs, minimizing external memory dependencies.
- Extensive I/O Count: 295 I/Os simplify board-level routing for designs requiring many interfaces or parallel connections.
- Industrial Reliability: Specified −40 °C to 100 °C operation and industrial grade suitability support deployments in harsh or temperature-variable environments.
- Compact, High-Density Package: 484-BBGA (23×23) surface-mount package enables high pin count in a compact footprint for dense system designs.
- Regulatory Compliance: RoHS compliance aids integration into products that must meet hazardous substance restrictions.
Why Choose LFE3-95EA-7FN484I?
The LFE3-95EA-7FN484I positions itself as a robust, industrial-grade FPGA option combining significant logic capacity, ample on-chip RAM, and a large I/O complement in a compact 484-BBGA footprint. It is well suited for engineers designing mid- to high-complexity embedded systems that require reliable operation across a wide temperature range.
For designs that prioritize integration, deterministic custom logic, and dense interfacing, this part offers a balance of performance and practical packaging that supports long-term deployment in industrial environments.
Request a quote or submit an inquiry to receive pricing and availability information for the LFE3-95EA-7FN484I. Our team can assist with lead times and ordering details.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016