LFE3-95EA-7FN484C

The LFE3-95EA-7FN484C is an ECP3 family FPGA manufactured by Lattice Semiconductor Corporation. It delivers a high-density, reconfigurable logic fabric with dedicated DSP and SERDES capabilities intended for high-volume, high-speed, cost-sensitive designs.

With 92,000 logic elements, approximately 4.526 Mbits of on-chip RAM and 295 user I/Os in a 484-BBGA package, this commercial-grade device targets applications that require substantial logic integration, flexible I/O and embedded memory while remaining RoHS compliant.

Key Features

• Logic Capacity — 92,000 logic elements to implement medium-to-large FPGA designs and complex custom logic.
• Embedded Memory — Approximately 4.526 Mbits of on-chip RAM (4,526,080 bits) for buffering, FIFOs and local data storage.
• DSP and Multiply Resources — ECP3 family sysDSP architecture with dedicated multiply-accumulate resources to accelerate signal processing and arithmetic-intensive tasks.
• High-speed SERDES — Embedded SERDES supporting 150 Mbps to 3.2 Gbps data rates and multi-channel serial links suitable for high-speed serial protocols.
• Flexible sysI/O™ — Programmable I/O buffer support across a wide range of standards, with on-chip termination and options for input equalization and output ISI correction.
• Clocking and Timing — Up to 10 PLLs and 2 DLLs per device to support multiple clock domains and high-performance timing architectures.
• Configuration and Reliability — Dual-boot configuration support, SPI boot flash interface and on-chip soft error detect macros for system-level flexibility.
• Package and Power — 484-BBGA (supplier package 484-FPBGA, 23×23 mm) surface-mount package with a core supply range of 1.14 V to 1.26 V and commercial operating temperature from 0 °C to 85 °C.
• Standards and Tools — Family-level support for source-synchronous interfaces, DDR memory with DQS support, and toolchain features such as Reveal Logic Analyzer and ORCAstra configuration utilities.

Typical Applications

• High-speed Communications — Use embedded SERDES and multi-channel serial support for interfaces such as Ethernet, PCIe, CPRI and other high-throughput links.
• Video and Broadcast — Leverage abundant logic, on-chip RAM and DSP resources for video frame buffering, format conversion and SMPTE 3G signal processing.
• Industrial & Instrumentation — Implement sensor interfaces, ADC/DAC front-end processing and deterministic logic functions using programmable sysI/O and DSP slices.
• Memory Interface and Subsystem Control — Dedicated DDR/DDR2/DDR3 memory support with DQS and source-synchronous I/O features for robust memory subsystems.

Unique Advantages

• High Logic Density: 92,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board-level complexity.
• Substantial On-chip Memory: Approximately 4.526 Mbits of embedded RAM enables larger local buffers and minimizes external memory dependence.
• Integrated High-speed IO: 295 user I/Os and programmable sysI/O support a broad set of interface standards, simplifying mixed-signal and multi-protocol designs.
• Power and Package Options: Compact 484-FPBGA (23×23 mm) surface-mount package with a defined 1.14–1.26 V core supply range for predictable power planning.
• Rich Clocking and DSP Resources: Up to 10 PLLs, 2 DLLs and the sysDSP architecture enable complex timing regimes and high-performance arithmetic processing on-chip.
• Commercial-grade, RoHS Compliant: Designed for commercial temperature operation (0 °C to 85 °C) and compliant with RoHS requirements.

Why Choose LFE3-95EA-7FN484C?

The LFE3-95EA-7FN484C balances high logic density, sizable embedded memory and extensive I/O in a compact 484-BBGA package, making it well suited for designs that require consolidation of logic, DSP and high-speed serial interfaces. Its ECP3 family heritage provides a combination of programmable DSP slices, SERDES and flexible sysI/O to address diverse system requirements.

This device is a strong fit for engineering teams designing high-speed communications equipment, video processing subsystems, industrial instrumentation, and memory interface controllers who need a commercially graded, RoHS-compliant FPGA with a predictable voltage and thermal envelope.

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