LFE3-95EA-6LFN672C

The LFE3-95EA-6LFN672C is a Lattice Semiconductor ECP3-family FPGA in a 672-ball BGA package optimized for high-density, cost-sensitive designs. It integrates a large FPGA fabric with abundant I/O and on-chip memory, making it suitable for high-volume, high-speed, low-cost applications that require signal processing, protocol bridging, or complex glue logic.

Built on the LatticeECP3 architecture, this device pairs enhanced DSP capabilities and source-synchronous I/O support with embedded SERDES and flexible configuration options to help engineers consolidate system functions while maintaining power- and area-efficient designs.

Key Features

• Logic Capacity  92,000 logic elements (cells) to implement complex digital functions and system-level integration.
• On-chip Memory  Approximately 4.53 Mbits of embedded memory (4,526,080 total RAM bits) for frame buffers, FIFOs, and intermediate processing storage.
• High I/O Count  380 user I/Os to support wide parallel interfaces, multiple peripherals, and board-level connectivity.
• Embedded SERDES and High-Speed Interfaces  Family-level support includes SERDES channels with data rates from 150 Mbps to 3.2 Gbps and common protocols such as PCI Express, SONET/SDH, Ethernet, CPRI, SMPTE 3G, and Serial RapidIO.
• Enhanced DSP (sysDSP)  Family architecture provides cascadable DSP slices for high-performance multiply–accumulate operations and advanced ALU support for signal-processing tasks.
• Flexible I/O Standards (sysI/O)  Programmable I/O buffers support a broad range of standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, Bus-LVDS, LVPECL, RSDS, MLVDS) with on-chip termination and optional input equalization.
• Clocking and Timing  Up to ten PLLs and two DLLs per device (family-level detail) to manage clock domains and support source-synchronous interfaces and memory timing requirements.
• Package & Mount  672-BBGA (supplier package: 672-FPBGA, 27 × 27 mm) surface-mount package suitable for compact, high-density board layouts.
• Power & Temperature  Core supply range 1.14 V to 1.26 V; commercial operating temperature 0 °C to 85 °C.
• Regulatory  RoHS compliant for lead‑free manufacturing processes.

Typical Applications

• High‑Speed Communications  Protocol bridging and line cards leveraging embedded SERDES and multi‑protocol support such as Ethernet, PCIe, and SONET/SDH.
• Video and Broadcast Processing  SMPTE 3G and high-bandwidth serial interfaces for video transport and preprocessing using embedded DSP resources and on-chip memory.
• Industrial and Consumer Connectivity  Multi-I/O interfacing, sensor aggregation, and protocol adaptation where high I/O count and flexible I/O standards are required.
• Signal Processing and Acceleration  Real‑time data path implementations using sysDSP slices and embedded memory for filtering, accumulation, and packet buffering.

Unique Advantages

• High Logic Density: 92,000 logic elements allow consolidation of multiple functions into a single device, reducing BOM and board area.
• Substantial Embedded Memory: Approximately 4.53 Mbits of on-chip RAM supports frame buffers, FIFOs, and local data storage without external RAM in many use cases.
• Large I/O Count with High-Speed Links: 380 I/Os combined with family SERDES support enable broad connectivity and multi-protocol interfacing on one device.
• Flexible I/O Standards: Programmable sysI/O buffers and on-chip termination simplify mixed-signal board designs and accelerate interface integration.
• Compact, Surface‑Mount Package: 672-BBGA (27 × 27 mm) offers a balance of I/O density and PCB space efficiency for compact system designs.
• Commercial‑Grade Operating Range: 0 °C to 85 °C rating aligns with mainstream embedded and consumer product requirements.

Why Choose LFE3-95EA-6LFN672C?

The LFE3-95EA-6LFN672C brings the LatticeECP3 family’s combination of DSP-optimized fabric, high-speed serial capabilities, and flexible I/O to designs that need high integration at controlled cost. With 92,000 logic elements, substantial on-chip memory, and 380 user I/Os in a compact 672-ball BGA package, it addresses demanding interface and processing requirements while streamlining system architecture.

This device is well suited to engineers building high-volume communications, video, and embedded processing products who need a reliable, programmable platform with a rich set of family-level features for SERDES, DSP, and flexible I/O standards. The RoHS compliance and surface-mount package further support modern manufacturing needs.

If you would like pricing, availability, or to request a quote for LFE3-95EA-6LFN672C, submit a quote request or inquiry to purchase through your usual procurement channel.