LFE3-95EA-6LFN484I

IC FPGA 295 I/O 484FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA

Quantity 601 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O295Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11500Number of Logic Elements/Cells92000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-95EA-6LFN484I – ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA

The LFE3-95EA-6LFN484I is a Lattice ECP3 family FPGA in a 484-pin FPBGA package optimized for high-density, cost‑sensitive system designs. It delivers a large programmable fabric with 92,000 logic elements, extensive I/O (295 pins) and embedded memory, making it suitable for high-speed communications, signal processing and industrial-grade applications.

Built on the ECP3 architecture, this device combines programmable logic, high-speed SERDES, advanced DSP resources and flexible I/O to integrate complex functions into a single device while operating from a 1.14–1.26 V supply and an industrial temperature range (−40 °C to 100 °C).

Key Features

  • Core Logic 92,000 logic elements provide significant LUT-based resources for complex custom logic and control functions.
  • Embedded Memory Approximately 4.53 Mbits of on-chip RAM (total RAM bits: 4,526,080) for buffering, packet staging and DSP data storage.
  • I/O Capacity & Package 295 user I/Os in a 484-FPBGA (23 × 23 mm) surface-mount package, enabling dense board-level connectivity while supporting industrial-grade operation.
  • High-Speed SERDES Family-level embedded SERDES support with data rates from 150 Mbps to 3.2 Gbps for multi‑protocol serial links and channelized interfaces.
  • Dedicated DSP Architecture (sysDSP) Fully cascadable slice architecture with support for 12–160 slices, powerful 54-bit ALU operations and slice-level multiplier configurations (half 36×36, two 18×18 or four 9×9 multipliers) for high-performance multiply‑accumulate workloads.
  • Clocking On-chip clock management with up to ten PLLs and two DLLs to support multiple clock domains and high-speed interface timing.
  • Flexible sysI/O Programmable I/O buffers and pre‑engineered source synchronous support with on-chip termination and optional input equalization; supports a broad range of interface standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL and others as described in the ECP3 family data).
  • Configuration & System Support Flexible configuration options including SPI boot flash interface, dual-boot image support, TransFR I/O for in-field updates, soft error detect macro, on-chip oscillator and IEEE 1149.1 / 1532 support.
  • Power & Environmental Core supply range 1.14–1.26 V, RoHS compliant and specified for industrial operation from −40 °C to 100 °C.

Typical Applications

  • High-Speed Communications: Implementation of protocol bridges, packet processing and interface adapters leveraging embedded SERDES and large I/O count for Ethernet, PCIe or similar links.
  • Video and Broadcast Processing: SMPTE and other video-interface designs that benefit from high logic density and dedicated DSP resources for real-time processing.
  • Signal Acquisition & Conversion: ADC/DAC interfacing and front-end processing where source synchronous I/O, on-chip memory and DSP MACs accelerate data path functions.
  • Industrial Systems: Control, automation and instrumentation applications requiring industrial temperature range, surface-mount packaging and robust programmable logic integration.

Unique Advantages

  • High Logic Density: 92,000 logic elements enable integration of complex control and processing functions into a single device, reducing system BOM.
  • Rich I/O Count in Compact Package: 295 user I/Os in a 23 × 23 mm FPBGA give designers broad connectivity without a large board footprint.
  • Integrated DSP and SERDES: Dedicated sysDSP slices plus family-level high-speed SERDES accelerate signal processing and serial link implementations.
  • Flexible Clocking and Timing: Multiple on-chip PLLs and DLLs simplify multi-domain clocking for high-performance designs.
  • Industrial-Grade Operation: Specified for −40 °C to 100 °C and RoHS compliant for deployment in demanding environments.

Why Choose LFE3-95EA-6LFN484I?

The LFE3-95EA-6LFN484I positions itself as a high‑density, application‑focused FPGA option within the Lattice ECP3 family. It combines a large LUT-based fabric, substantial embedded RAM and extensive I/O in a compact 484‑pin FPBGA package, delivering the integration and flexibility needed for communications, video, signal acquisition and industrial designs.

Its combination of sysDSP resources, configurable I/O, SERDES capability and a broad set of configuration features make it suitable for engineers seeking a scalable, reliable building block with proven family-level support and tooling.

Request a quote or submit a purchasing inquiry to learn about availability, pricing and lead times for the LFE3-95EA-6LFN484I.

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