LFE3-95EA-7FN1156C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 490 4526080 92000 1156-BBGA |
|---|---|
| Quantity | 742 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FPBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA | Number of I/O | 490 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11500 | Number of Logic Elements/Cells | 92000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-95EA-7FN1156C – ECP3 Field Programmable Gate Array (FPGA) IC 490 4526080 92000 1156-BBGA
The LFE3-95EA-7FN1156C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for applications that require substantial programmable logic, on-chip memory, and a high I/O count. It delivers a balanced combination of logic capacity, embedded RAM, and dense I/O in a compact 1156-BBGA package.
With 92,000 logic elements and approximately 4.53 Mbits of embedded memory, this commercial-grade device addresses designs where integration and I/O density are key considerations while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature window.
Key Features
- Core Logic Capacity — 92,000 logic elements provide extensive programmable logic resources for complex digital functions and custom accelerators.
- Embedded Memory — Approximately 4.53 Mbits of on-chip RAM supports data buffering, FIFOs, and small memory-intensive functions without external memory.
- High I/O Count — 490 user I/O pins enable connectivity to multiple interfaces, sensors, and peripherals in dense system designs.
- Package and Mounting — Available in a 1156-BBGA (supplier package: 1156-FPBGA, 35×35 mm) with surface-mount mounting for compact board layouts.
- Power — Operates from a 1.14 V to 1.26 V supply range to match system power architectures.
- Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for standard commercial applications.
- Compliance — RoHS-compliant to support environmental and manufacturing requirements.
Typical Applications
- Programmable Logic Designs — Implement complex logic functions, state machines, and protocol processing using the device’s 92,000 logic elements and embedded RAM.
- High I/O Systems — Ideal for systems that require many external connections, leveraging 490 I/O pins for parallel interfaces, sensor arrays, and multi-channel I/O.
- Compact, High-Density Boards — Suited for space-constrained PCBs that benefit from the 1156-BBGA package and surface-mount assembly.
Unique Advantages
- Substantial Logic Resources: 92,000 logic elements provide headroom for implementing complex designs without immediate need for external accelerators.
- On-Chip Memory: Approximately 4.53 Mbits of embedded RAM reduces reliance on external memory, lowering BOM complexity and improving data path latency.
- High I/O Density: 490 I/O pins enable flexible interfacing and the consolidation of multiple peripheral connections on a single device.
- Compact Packaging: The 1156-BBGA (1156-FPBGA, 35×35) package lets you integrate high capability into compact board layouts.
- Designed for Standard Commercial Environments: Operates across a 0 °C to 85 °C range and RoHS compliance supports typical commercial product lifecycles and manufacturing processes.
Why Choose LFE3-95EA-7FN1156C?
The LFE3-95EA-7FN1156C positions itself as a high-capacity, commercially graded FPGA offering strong integration of logic, embedded memory, and I/O in a compact package. It is well suited for engineers and teams building systems that require significant programmable logic and dense external connectivity while maintaining a streamlined BOM.
This device is a practical choice for designs that demand scalability of logic resources, on-chip memory for data handling, and a high pin count for complex interfacing. Backed by Lattice Semiconductor Corporation’s ecosystem, the part supports development workflows that prioritize integration and board-level density.
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Date Founded: 1983
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