LFE3-95EA-7FN1156C

IC FPGA 490 I/O 1156FBGA
Part Description

ECP3 Field Programmable Gate Array (FPGA) IC 490 4526080 92000 1156-BBGA

Quantity 742 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1156-BBGANumber of I/O490Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs11500Number of Logic Elements/Cells92000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4526080

Overview of LFE3-95EA-7FN1156C – ECP3 Field Programmable Gate Array (FPGA) IC 490 4526080 92000 1156-BBGA

The LFE3-95EA-7FN1156C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for applications that require substantial programmable logic, on-chip memory, and a high I/O count. It delivers a balanced combination of logic capacity, embedded RAM, and dense I/O in a compact 1156-BBGA package.

With 92,000 logic elements and approximately 4.53 Mbits of embedded memory, this commercial-grade device addresses designs where integration and I/O density are key considerations while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C temperature window.

Key Features

  • Core Logic Capacity — 92,000 logic elements provide extensive programmable logic resources for complex digital functions and custom accelerators.
  • Embedded Memory — Approximately 4.53 Mbits of on-chip RAM supports data buffering, FIFOs, and small memory-intensive functions without external memory.
  • High I/O Count — 490 user I/O pins enable connectivity to multiple interfaces, sensors, and peripherals in dense system designs.
  • Package and Mounting — Available in a 1156-BBGA (supplier package: 1156-FPBGA, 35×35 mm) with surface-mount mounting for compact board layouts.
  • Power — Operates from a 1.14 V to 1.26 V supply range to match system power architectures.
  • Commercial Grade Temperature — Rated for 0 °C to 85 °C operation for standard commercial applications.
  • Compliance — RoHS-compliant to support environmental and manufacturing requirements.

Typical Applications

  • Programmable Logic Designs — Implement complex logic functions, state machines, and protocol processing using the device’s 92,000 logic elements and embedded RAM.
  • High I/O Systems — Ideal for systems that require many external connections, leveraging 490 I/O pins for parallel interfaces, sensor arrays, and multi-channel I/O.
  • Compact, High-Density Boards — Suited for space-constrained PCBs that benefit from the 1156-BBGA package and surface-mount assembly.

Unique Advantages

  • Substantial Logic Resources: 92,000 logic elements provide headroom for implementing complex designs without immediate need for external accelerators.
  • On-Chip Memory: Approximately 4.53 Mbits of embedded RAM reduces reliance on external memory, lowering BOM complexity and improving data path latency.
  • High I/O Density: 490 I/O pins enable flexible interfacing and the consolidation of multiple peripheral connections on a single device.
  • Compact Packaging: The 1156-BBGA (1156-FPBGA, 35×35) package lets you integrate high capability into compact board layouts.
  • Designed for Standard Commercial Environments: Operates across a 0 °C to 85 °C range and RoHS compliance supports typical commercial product lifecycles and manufacturing processes.

Why Choose LFE3-95EA-7FN1156C?

The LFE3-95EA-7FN1156C positions itself as a high-capacity, commercially graded FPGA offering strong integration of logic, embedded memory, and I/O in a compact package. It is well suited for engineers and teams building systems that require significant programmable logic and dense external connectivity while maintaining a streamlined BOM.

This device is a practical choice for designs that demand scalability of logic resources, on-chip memory for data handling, and a high pin count for complex interfacing. Backed by Lattice Semiconductor Corporation’s ecosystem, the part supports development workflows that prioritize integration and board-level density.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the LFE3-95EA-7FN1156C. Our team can provide a formal quote and help with order placement and supply details.

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