LFE3-95EA-6LFN1156C

The LFE3-95EA-6LFN1156C is a Lattice ECP3 family FPGA in a 1156-ball BGA package designed for commercial embedded applications. It delivers a large logic fabric—92,000 logic elements—alongside high I/O count and multi-megabit on-chip memory to support complex interface, signal processing and system-integration tasks.

With approximately 4.53 Mbits of embedded memory, flexible clocking resources, and a 1.14 V to 1.26 V core supply range, this surface-mount device is suited for high-density digital designs requiring extensive I/O, on-chip RAM and DSP resources within a 35 × 35 mm package footprint.

Key Features

• Core Logic  92,000 logic elements provide ample programmable fabric for glue logic, protocol handling and custom acceleration.
• Embedded Memory  Approximately 4.53 Mbits of on-chip RAM for frame buffering, packet processing, and state storage.
• I/O Capacity  490 user I/Os in a 1156-BBGA (1156-FPBGA, 35 × 35 mm) package supports wide interface integration and high-pin-count connectivity.
• High-Speed Serial and Interface Support  Family-level SERDES capability supports multi-protocol serial links with data rates from 150 Mbps to 3.2 Gbps, enabling interfaces such as Ethernet, PCI Express and other serial protocols.
• DSP Capability  sysDSP architecture (family feature) provides cascaded DSP slices and high-performance multiply/accumulate resources for signal processing tasks.
• Clocking  Device supports multiple PLLs and DLLs (family-level support) for flexible frequency synthesis and timing management.
• Configuration and Field Updates  Flexible device configuration options including SPI boot and dual-boot image support (family-level features) for in-field update strategies.
• Power and Thermal  Core operating voltage 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C. Surface-mount package for standard PCB assembly processes.
• Compliance  RoHS compliant.

Typical Applications

• Networking & Telecommunications  Use for packet processing, SERDES-enabled link aggregation and protocol bridging where multi-gigabit serial links and high I/O count are required.
• Video & Broadcast Interfaces  Leverage on-chip memory and DSP resources for video buffering, formatting and transport, including support for high-speed serial media interfaces.
• Data Acquisition & Signal Processing  Implement ADC/DAC interfacing, filtering and real-time DSP tasks using the device’s embedded memory and DSP slices.
• Memory Interface and Buffering  Dedicated support for DDR/DDR2/DDR3 memory interfaces (family-level feature) makes the device suitable for designs requiring external memory control and data buffering.

Unique Advantages

• High logic density: 92,000 logic elements allow consolidation of multiple functions and offloads from external controllers, reducing system BOM.
• Large on-chip RAM: Approximately 4.53 Mbits of embedded memory supports deep buffering and high-throughput data paths without immediate need for external RAM.
• Extensive I/O in compact package: 490 user I/Os in a 35 × 35 mm FPBGA package enable dense connectivity for complex peripheral and high-speed interface requirements.
• Flexible serial and timing resources: Family-level SERDES and multiple PLL/DLL resources provide the timing and high-speed link support needed for modern serial protocols.
• Commercial-grade readiness: Surface-mount, RoHS-compliant construction and 0 °C to 85 °C operating range fit a wide range of commercial embedded applications.

Why Choose LFE3-95EA-6LFN1156C?

This Lattice ECP3 device balances high logic capacity, significant embedded memory and broad I/O capabilities in a single, surface-mount 1156-BBGA package. It is positioned for engineers designing high-density, interface-rich systems that require on-chip buffering, DSP resources and multi-protocol serial connectivity while operating within a commercial temperature range.

Ideal for teams building network, multimedia, and data acquisition systems, the LFE3-95EA-6LFN1156C offers an integrated platform to consolidate functions, simplify PCB routing and reduce component count—backed by the ECP3 family feature set for clocking, configuration and serial link support.

Request a quote or submit a request for pricing and availability to move your design forward with the LFE3-95EA-6LFN1156C.