LFE3-95EA-6FN484C
| Part Description |
ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA |
|---|---|
| Quantity | 689 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 295 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 11500 | Number of Logic Elements/Cells | 92000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4526080 |
Overview of LFE3-95EA-6FN484C – ECP3 Field Programmable Gate Array (FPGA) IC 295 4526080 92000 484-BBGA
The LFE3-95EA-6FN484C is an FPGA device in the Lattice ECP3 family designed for high-density, high-throughput system integration. It delivers a large logic fabric, abundant on-chip memory, and extensive I/O in a compact 484-ball BGA package for commercial-grade embedded and communications applications.
Targeted use cases include high-speed serial interfaces, DSP-accelerated data processing, and applications requiring substantial I/O and embedded RAM. The device combines programmable logic resources with embedded SERDES, sysDSP capabilities and multiple clock management blocks to support demanding system designs.
Key Features
- Logic Capacity Approximately 92,000 logic elements, providing substantial programmable fabric for complex control, protocol and processing functions.
- On-chip Memory Approximately 4.53 Mbits of total on-chip RAM (4,526,080 bits) to support large buffering, data storage and memory-intensive logic.
- I/O Density 295 user I/Os in the 484-ball package, enabling wide parallel interfaces and flexible pin assignments for mixed-signal and multi-protocol designs.
- Embedded SERDES Four SERDES channels supported in this package configuration; family-level SERDES data rates supported up to 3.2 Gbps (per datasheet).
- sysDSP and Multipliers Enhanced sysDSP architecture with dedicated DSP resources and 128 18×18 multipliers for high-performance multiply-accumulate and signal processing tasks (family datasheet).
- Clock Management Device-level clock resources include up to ten PLLs and two DLLs to support complex clocking and multi-rate designs (per family datasheet).
- Package and Mounting 484-BBGA package case, supplier device package 484-FPBGA (23×23 mm), surface-mount type for compact board-level integration.
- Power and Temperature Voltage supply range 1.14 V to 1.26 V with operating temperature 0 °C to 85 °C; commercial-grade device.
- Compliance RoHS compliant.
Typical Applications
- High-speed serial connectivity SERDES channels and extensive I/O make the device suitable for implementing PCIe, Ethernet, SONET/SDH or other serial links at multi-gigabit rates (family-level interfaces supported).
- Real-time signal processing sysDSP architecture and 18×18 multipliers enable DSP tasks such as filtering, FFT stages, and accelerated numeric processing in communications and video systems.
- Embedded system control Large logic capacity and abundant I/O support complex control, protocol handling, and glue-logic tasks in industrial and commercial embedded platforms.
- Memory-intensive buffering Approximately 4.53 Mbits of on-chip RAM supports deep buffering and packet/stream storage for network and streaming applications.
Unique Advantages
- High integration density: Combining ~92,000 logic elements with ~4.53 Mbits of RAM and 295 I/Os reduces external component count and simplifies system BOM.
- Multi-protocol serial support: On-package SERDES capability (4 channels) and family-level support for up to 3.2 Gbps data rates enable flexible high-speed link implementation.
- DSP-ready fabric: sysDSP slices and 128 18×18 multipliers provide a hardware-accelerated path for compute-heavy signal processing tasks.
- Robust clocking resources: Multiple PLLs and DLLs afford flexible clock domain management for mixed-rate, multi-interface systems.
- Compact, board-friendly package: 484-FPBGA (23×23 mm) surface-mount package balances pin density and board footprint for space-constrained designs.
- Commercial-grade, RoHS compliant: Suited for mainstream embedded applications with environmental compliance for lead-free assembly.
Why Choose LFE3-95EA-6FN484C?
The LFE3-95EA-6FN484C provides a balanced combination of logic capacity, on-chip memory and high I/O density in a single commercial-grade FPGA. Its integration of SERDES channels, sysDSP resources and extensive clock management makes it well suited for designs that require both high-speed interfaces and DSP compute in a compact package.
This device is ideal for engineering teams building communications, streaming, or embedded control systems that need scalable logic, ample RAM for buffering, and flexible I/O. The Lattice ECP3 family datasheet-level features referenced here support designers seeking proven FPGA building blocks with a mature ecosystem.
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