LFE3-95EA-6FN1156C

The LFE3-95EA-6FN1156C is a Lattice Semiconductor ECP3 family Field Programmable Gate Array (FPGA) in a 1156-BBGA package. It delivers a high-density, configurable logic fabric with 92,000 logic elements, approximately 4.53 Mbits of embedded memory, and up to 490 user I/Os for complex, system-level integration.

Designed for commercial applications, this surface-mount FPGA targets high-volume, high-performance use cases where integration, I/O capacity, and on-chip memory are key value drivers.

Key Features

• Core Logic 92,000 logic elements provide substantial programmable logic capacity for complex designs and system integration.
• Embedded Memory Approximately 4.53 Mbits of on-chip RAM for buffering, packet handling, and intermediate data storage.
• I/O Density Up to 490 user I/Os in the 1156-BBGA package to support wide parallel interfaces and dense connectivity.
• Packaging & Mounting 1156-FPBGA (35 × 35 mm) package in a surface-mount implementation for board-level integration.
• Power Core voltage supply range 1.14 V to 1.26 V for compatibility with system power rails.
• Operating Range Commercial grade device with operating temperature 0 °C to 85 °C.
• Family Capabilities Built on the Lattice ECP3 architecture with features such as embedded SERDES, sysDSP slices, PLLs/DLLs and flexible source-synchronous I/O (described in the ECP3 family datasheet).
• Compliance RoHS compliant for environmental regulatory alignment.

Typical Applications

• High-speed communications Leverage the ECP3 familyʼs SERDES and abundant I/Os for protocol bridging, packet processing, and multi‑lane interfaces.
• Video and broadcast processing Use the device's memory and DSP-oriented resources for video framing, buffering, and transport interfaces.
• Industrial and instrumentation Implement sensor aggregation, protocol conversion, and custom control logic within the device's logic and I/O capacity.
• Embedded systems Integrate peripherals, glue logic, and hardware accelerators to reduce board-level component count and simplify system design.

Unique Advantages

• High integration density: 92,000 logic elements and substantial embedded memory reduce external components and PCB area.
• Large I/O count: 490 user I/Os in a single 1156‑pin package enable dense system interconnect and parallel interfaces.
• Optimized power envelope: Narrow core voltage range (1.14 V–1.26 V) aligns with modern supply architectures for predictable power planning.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match common commercial product requirements.
• Proven family feature set: Implements ECP3 family capabilities—embedded SERDES, sysDSP, PLLs/DLLs and source-synchronous I/O—facilitating high-performance designs.
• RoHS compliant: Meets regulatory requirements for lead‑free manufacturing.

Why Choose LFE3-95EA-6FN1156C?

This Lattice ECP3 FPGA balances high logic density, on-chip memory, and extensive I/O in a compact 1156‑pin package, making it a practical choice for commercial systems that require significant programmable logic and interface bandwidth. It is suitable for designers aiming to consolidate discrete functions, implement hardware accelerators, or bridge multiple high-speed interfaces within a single device.

Backed by the ECP3 family feature set and Lattice documentation, the LFE3-95EA-6FN1156C offers a scalable platform for deploying mid-to-high complexity FPGA functions while maintaining compatibility with standard commercial temperature and power domains.

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