LFE3-95E-8FN672I

The LFE3-95E-8FN672I is a member of the LatticeECP3 FPGA family: a reconfigurable SRAM-based FPGA optimized for high integration and system-level features. This device delivers 92,000 logic elements, approximately 4.53 Mbits of on-chip embedded memory, and 380 user I/Os in a 672-ball FBGA (27 × 27 mm) package for industrial-grade embedded designs.

Designed for applications that require a balance of logic density, embedded memory and flexible I/O, the device supports advanced DSP building blocks, embedded SERDES and a broad set of I/O standards to simplify system integration and accelerate time-to-market.

Key Features

• Core Logic — 92,000 logic elements provide substantial LUT-based programmable logic resources for complex control, processing and glue-logic tasks.
• Embedded Memory — 4,526,080 bits of on-chip RAM (approximately 4.53 Mbits) for block RAM and distributed memory needs.
• I/O Density & Flexibility — 380 user I/Os in the 672-FPBGA (27×27 mm) package, enabling wide external connectivity and board-level routing options.
• High-speed Serial and Synchronous Interfaces — Family-level embedded SERDES and pre‑engineered source-synchronous I/O support for high-speed serial and parallel data paths as described in the LatticeECP3 family documentation.
• sysDSP and Arithmetic Support — Family architecture includes optimized sysDSP slices and multiplier resources for MAC-intensive signal processing and algorithm acceleration.
• Programmable Clocking — On-chip PLLs and DLLs available at the family level to support flexible clocking and timing architectures.
• Power — Core supply range specified at 1.14 V to 1.26 V to match system power architectures; device supports standard low-voltage FPGA supply conditions.
• Package & Mounting — 672-BBGA (672-FPBGA, 27×27 mm) surface-mount package optimized for compact system designs.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in industrial application environments.
• Standards & Configuration — Family documentation describes flexible configuration options (SPI boot flash interface, dual-boot images, and configuration I/O bank support) and system-level utilities for device configuration and debugging.

Typical Applications

• Industrial Control & Automation — Implement complex control logic, sensor aggregation and real-time processing using abundant logic elements and on-chip RAM while meeting industrial temperature requirements.
• High-density Networking and Datacom — Use built-in SERDES and source-synchronous I/O capabilities to handle serial links and parallel interfaces in communication modules and protocol bridging.
• Signal Processing & Embedded Acceleration — Leverage sysDSP slices and multiplier resources for filter, FFT and MAC-heavy processing tasks in compact FPGA-based accelerators.
• Interface Bridging and I/O Expansion — 380 I/Os provide flexibility for protocol translation, multi‑interface hubs, and board-level glue logic in embedded systems.

Unique Advantages

• High logic density: 92,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level BOM and interconnect complexity.
• Substantial on-chip memory: Approximately 4.53 Mbits of embedded memory supports large buffering, frame storage and local data sets without external RAM.
• Flexible I/O and package options: 380 I/Os in a 672-ball FBGA package provide a compact, high-pin-count solution for complex system I/O requirements.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in a wide range of industrial environments.
• Deterministic power window: Defined core supply range (1.14 V to 1.26 V) helps simplify power-supply design and verification.
• System-level feature set: Family-level PLLs/DLLs, configuration options and on-chip utilities aid in system integration and accelerate development.

Why Choose LFE3-95E-8FN672I?

The LFE3-95E-8FN672I combines a high count of logic elements with multi-megabit embedded memory and a high I/O count in a compact industrial-grade FBGA package, making it well suited for embedded designs that require significant on-chip resources and robust operating temperature range. Its family-level features for DSP, SERDES and programmable I/O support help streamline implementation of high-throughput interfaces and signal-processing tasks.

This device is a practical choice for engineering teams targeting industrial control, networking, and embedded acceleration where integration, predictable power requirements and system-level configurability matter. The LatticeECP3 family feature set and device specifications provide a clear upgrade path within the same architecture for scaling designs.

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