LFE3-95E-8FN672C

The LFE3-95E-8FN672C is an ECP3 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a high-count programmable logic fabric with approximately 92,000 logic elements and approximately 4.5 Mbits of embedded memory for mid- to high-density designs.

This device features a 380-pin I/O footprint, a 672-ball BGA package, low core supply voltage range (1.14 V to 1.26 V), and commercial-grade operation from 0 °C to 85 °C, making it suitable for a wide range of surface-mount electronic applications.

Key Features

• Core Logic Capacity — Approximately 92,000 logic elements and 11,500 logic blocks provide substantial programmable logic resources for complex designs.
• Embedded Memory — Approximately 4.5 Mbits of on-chip RAM to support data buffering, packet handling, and intermediate storage without external memory.
• I/O Density — 380 available I/O pins support diverse interface requirements and multiple external connections.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match modern low-voltage system domains.
• Package & Mounting — 672-BBGA (supplier package: 672-FPBGA, 27×27) in a surface-mount form factor for compact board integration.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for environmentally conscious designs.

Typical Applications

• High-density digital processing — Use the large logic element count and embedded RAM for packet processing, signal aggregation, or custom data-path implementations.
• Interface bridging and protocol conversion — 380 I/Os provide the pin resources needed to connect multiple buses and external devices in protocol-translation roles.
• Embedded control and sequencing — On-chip logic and memory enable implementation of control state machines and firmware-accelerated functions without relying on external processors.
• Compact, high-pin-count board designs — The 672-BBGA package supports high I/O density in space-constrained surface-mount assemblies.

Unique Advantages

• High programmable capacity: Approximately 92,000 logic elements and 11,500 logic blocks give designers headroom for complex, multi-function implementations.
• Embedded memory on chip: Approximately 4.5 Mbits of RAM reduces dependency on external memory, simplifying BOM and board routing.
• Large I/O complement: 380 I/O pins enable direct connectivity to multiple interfaces and peripherals, minimizing the need for external multiplexing.
• Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with modern low-power system domains while providing predictable power characteristics.
• RoHS compliant and surface-mount package: 672-BBGA surface-mount footprint supports reliable assembly and regulatory compliance for commercial products.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation for mainstream electronics and industrial-adjacent applications where commercial grade is appropriate.

Why Choose LFE3-95E-8FN672C?

The LFE3-95E-8FN672C balances high logic capacity, substantial on-chip memory, and a large I/O set in a compact 672-ball BGA package. It is positioned for designers who need programmable logic density and embedded RAM in a commercial-grade FPGA for surface-mount board designs.

Backed by Lattice Semiconductor Corporation, this part provides a scalable option for mid- to high-density FPGA implementations where integration, I/O flexibility, and controlled power domains are required.

Request a quote or contact sales to submit your procurement or pricing inquiry for the LFE3-95E-8FN672C.