LFE3-95EA-6LFN1156I

The LFE3-95EA-6LFN1156I is an ECP3 family FPGA optimized for mid-to-high density embedded logic implementations. With 92,000 logic elements and 11,500 CLBs, it provides extensive programmable fabric for complex control, signal processing, and interface consolidation tasks. Its combination of high I/O count and on-chip memory makes it suitable for industrial designs that require integration and scalability.

Key Features

• Logic Capacity  11,500 CLBs delivering 92,000 logic elements to support complex combinational and sequential logic designs.
• Embedded Memory  Approximately 4.53 Mbits of on-chip RAM for buffering, packet storage, and local data processing.
• I/O Density  490 I/O pins to enable multiple high-pin-count interfaces and flexible board-level connectivity.
• Power  Core supply range from 1.14 V to 1.26 V for defined power planning and thermal budgeting in system designs.
• Package & Mounting  1156-BBGA package (supplier device package: 1156-FPBGA, 35 × 35 mm) with surface-mount construction for compact board implementation.
• Temperature & Grade  Industrial-grade device rated for operation from -40 °C to 100 °C, suitable for robust embedded and industrial environments.
• Regulatory Compliance  RoHS compliant to support environmentally conscious manufacturing and assembly requirements.

Typical Applications

• Industrial Control  Implement real-time control logic, motor control interfaces, and deterministic sequencing using abundant logic and I/O resources.
• Communications Equipment  Integrate protocol bridging, packet buffering, and custom interface logic leveraging the device’s high I/O count and on-chip RAM.
• Video and Signal Processing  Buffering and intermediate processing stages can be implemented using the device’s memory and sizeable logic fabric.
• Sensor and Instrumentation Systems  Aggregate and preprocess sensor data with flexible I/O and embedded memory to reduce system-level component count.

Unique Advantages

• High Logic Density: 92,000 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing system complexity.
• Generous Embedded Memory: Approximately 4.53 Mbits of on-chip RAM supports buffering and transient data storage without external memory in many designs.
• Extensive I/O Count: 490 I/Os enable direct interfacing to numerous peripherals and subsystems, simplifying board-level routing and integration.
• Industrial Temperature Range: Rated for -40 °C to 100 °C operation, supporting deployment in temperature-challenging environments.
• Compact Ball Grid Package: 1156-BBGA (35 × 35 mm) balances pin count and board area for space-constrained applications.
• RoHS Compliant: Helps meet regulatory and manufacturing requirements for environmentally responsible products.

Why Choose LFE3-95EA-6LFN1156I?

The LFE3-95EA-6LFN1156I positions itself as a capable mid-to-high density FPGA offering a balance of logic, memory, and I/O for industrial embedded systems. Its industrial temperature rating and RoHS compliance make it a reliable choice for long-life designs that require stable operation across a wide temperature range.

Design teams seeking to reduce board-level component count and consolidate discrete functions will find the device’s combination of CLBs, logic elements, and embedded RAM useful for scaling complex control, processing, and interfacing tasks while maintaining a compact package footprint.

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